Wiring board and power conversion device

The invention provides a wiring board and a power conversion device, which can further improve the reliability when a plurality of semiconductor elements connected in parallel are driven by one drive circuit. The wiring board includes: a pair of hard substrates provided for each of a plurality of se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIGUCHI TATSUMASA, TAKUBO HIROMU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a wiring board and a power conversion device, which can further improve the reliability when a plurality of semiconductor elements connected in parallel are driven by one drive circuit. The wiring board includes: a pair of hard substrates provided for each of a plurality of semiconductor switching elements connected in parallel; a soft substrate provided so that at least a portion thereof is sandwiched between the pair of hard substrates (410a), the pair of hard substrates (410b), and the pair of hard substrates (410c); electrodes (460a-460c) that are connected to the gate terminals of the semiconductor switching elements; electrodes (470a-470c) that are connected to the source terminals of the semiconductor switching elements; a wiring (480), at least a portion of which is provided on the soft substrate, and which connects the electrodes (460a-460c) in parallel; and a wiring (490), at least a portion of which is provided on the soft substrate, and which connects the electrodes (470a-47