Jacking mechanism and marking equipment

Jacking mechanism and marking equipment

The invention discloses a jacking mechanism and marking equipment, the jacking mechanism is used for jacking chips, a plurality of chip layers are stacked in a material box, the jacking mechanism comprises a rack, an adjusting assembly and a jacking assembly, the rack forms an open placing cavity, t...

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Hauptverfasser: YANG JIANXIN, ZHOU XUEHUI, ZHANG KAI, LI WENQIANG, SHENG HUI, ZHONG HENG, ZHU TING, LIAO GAOFENG, MA QIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YANG JIANXIN
ZHOU XUEHUI
ZHANG KAI
LI WENQIANG
SHENG HUI
ZHONG HENG
ZHU TING
LIAO GAOFENG
MA QIN
description The invention discloses a jacking mechanism and marking equipment, the jacking mechanism is used for jacking chips, a plurality of chip layers are stacked in a material box, the jacking mechanism comprises a rack, an adjusting assembly and a jacking assembly, the rack forms an open placing cavity, the placing cavity is used for placing the material box, the adjusting assembly is arranged at one end of the rack, an adjustable placing groove is formed in the adjusting assembly, and the jacking assembly is arranged in the placing groove. The containing groove communicates with the containing cavity and is used for limiting the material box, the jacking assembly is arranged at the end, away from the adjusting assembly, of the rack, and the jacking assembly is provided with a jacking plate; the jacking assembly drives the jacking plate to push the chips in the material box so that the chips can move towards one end of the adjusting assembly along the material box. According to the jacking mechanism, jacking or con
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Jacking mechanism and marking equipment
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