Chip test fixture

The invention belongs to the technical field of semiconductors, and discloses a chip test fixture. The chip test fixture comprises a heat conduction base, a probe mechanism and a heat dissipation mechanism, a containing groove is formed in the middle of the heat conduction base, a positioning frame...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JI YINGDONG, HOU QISHENG, GAO ZONGYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
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