Method for protecting semiconductor test piece in material analysis process

Method for protecting semiconductor test piece in material analysis process

The invention provides a method for protecting a semiconductor test piece in a material analysis process. The method comprises the following steps: S1, placing the semiconductor test piece on an operation platform; s2, delaminating the semiconductor test piece to a specific level needing to be analy...

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Hauptverfasser: LIU JILUN, ZHANG SHIXIN, CHEN RONGQIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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creator LIU JILUN
ZHANG SHIXIN
CHEN RONGQIN
description The invention provides a method for protecting a semiconductor test piece in a material analysis process. The method comprises the following steps: S1, placing the semiconductor test piece on an operation platform; s2, delaminating the semiconductor test piece to a specific level needing to be analyzed in a delaminating manner; s3, pouring glue on the exposed layer of the semiconductor test piece after the layer is removed, and heating; and S4, when the heating temperature reaches a specified temperature, stopping heating and solidifying the glue into colloid, and enabling the colloid to be completely attached to the exposed layer of the semiconductor test piece after the layer is removed. According to the method, the colloid is prepared on the surface of the delaminated semiconductor test piece, the colloid is heated to reach a specified temperature, and the characteristic that the molten colloid can be completely attached to the surface of the delaminated semiconductor test piece is utilized, so that extern
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Method for protecting semiconductor test piece in material analysis process
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