Polyimide polymer as well as preparation method and application thereof
The invention discloses a polyimide polymer as well as a preparation method and application thereof. The polyimide polymer has a structure as shown in a formula (I), wherein n ranges from 50 to 500; r1 is selected from H and C1-3 alkyl groups; r2 is selected from-OR3 groups which are monosubstituted...
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| creator | GAN FENG MA CHUNPING WU YANCHENG ZHANG YANGFAN LIAN MANYU HUANG GUOTAO YI NINGBO |
| description | The invention discloses a polyimide polymer as well as a preparation method and application thereof. The polyimide polymer has a structure as shown in a formula (I), wherein n ranges from 50 to 500; r1 is selected from H and C1-3 alkyl groups; r2 is selected from-OR3 groups which are monosubstituted or polysubstituted, and R3 is selected from at least one of the groups. A large-volume siloxane side group is introduced into the structural formula of the polyimide polymer. A PI main chain has a triphenylmethane structure, so that the heat-resistant and mechanical properties are excellent. On the other hand, due to introduction of siloxane side groups, the stacking density of molecular chains and formation of charge transfer compounds (CTCs) can be remarkably reduced, and the dielectric property, the light transmittance and the solubility of the prepared PI film are all improved.
本发明公开了一种聚酰亚胺聚合物及其制备方法和应用，其聚酰亚胺聚合物具有式(Ⅰ)所示的结构：其中n的范围为50～500；R1选自H、C1～3的烷基；R2选自-OR3基团为单取代或多取代，所述R3选自中的至少一种。本发明的聚酰亚胺聚合物的结构式中引入了大体积的硅氧烷侧基。 |
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本发明公开了一种聚酰亚胺聚合物及其制备方法和应用，其聚酰亚胺聚合物具有式(Ⅰ)所示的结构：其中n的范围为50～500；R1选自H、C1～3的烷基；R2选自-OR3基团为单取代或多取代，所述R3选自中的至少一种。本发明的聚酰亚胺聚合物的结构式中引入了大体积的硅氧烷侧基。</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=CN&NR=116515109A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=CN&NR=116515109A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GAN FENG</creatorcontrib><creatorcontrib>MA CHUNPING</creatorcontrib><creatorcontrib>WU YANCHENG</creatorcontrib><creatorcontrib>ZHANG YANGFAN</creatorcontrib><creatorcontrib>LIAN MANYU</creatorcontrib><creatorcontrib>HUANG GUOTAO</creatorcontrib><creatorcontrib>YI NINGBO</creatorcontrib><title>Polyimide polymer as well as preparation method and application thereof</title><description>The invention discloses a polyimide polymer as well as a preparation method and application thereof. The polyimide polymer has a structure as shown in a formula (I), wherein n ranges from 50 to 500; r1 is selected from H and C1-3 alkyl groups; r2 is selected from-OR3 groups which are monosubstituted or polysubstituted, and R3 is selected from at least one of the groups. A large-volume siloxane side group is introduced into the structural formula of the polyimide polymer. A PI main chain has a triphenylmethane structure, so that the heat-resistant and mechanical properties are excellent. On the other hand, due to introduction of siloxane side groups, the stacking density of molecular chains and formation of charge transfer compounds (CTCs) can be remarkably reduced, and the dielectric property, the light transmittance and the solubility of the prepared PI film are all improved.
本发明公开了一种聚酰亚胺聚合物及其制备方法和应用，其聚酰亚胺聚合物具有式(Ⅰ)所示的结构：其中n的范围为50～500；R1选自H、C1～3的烷基；R2选自-OR3基团为单取代或多取代，所述R3选自中的至少一种。本发明的聚酰亚胺聚合物的结构式中引入了大体积的硅氧烷侧基。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPyM-pzMzNTElVKACyclOLFBKLFcpTc3JAdEFRakFiUWJJZn6eQm5qSUZ-ikJiHhAXFORkJkOESzJSi1Lz03gYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhmamhqaGBpaMxMWoAi0E0Mg</recordid><startdate>20230801</startdate><enddate>20230801</enddate><creator>GAN FENG</creator><creator>MA CHUNPING</creator><creator>WU YANCHENG</creator><creator>ZHANG YANGFAN</creator><creator>LIAN MANYU</creator><creator>HUANG GUOTAO</creator><creator>YI NINGBO</creator><scope>EVB</scope></search><sort><creationdate>20230801</creationdate><title>Polyimide polymer as well as preparation method and application thereof</title><author>GAN FENG ; MA CHUNPING ; WU YANCHENG ; ZHANG YANGFAN ; LIAN MANYU ; HUANG GUOTAO ; YI NINGBO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116515109A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>GAN FENG</creatorcontrib><creatorcontrib>MA CHUNPING</creatorcontrib><creatorcontrib>WU YANCHENG</creatorcontrib><creatorcontrib>ZHANG YANGFAN</creatorcontrib><creatorcontrib>LIAN MANYU</creatorcontrib><creatorcontrib>HUANG GUOTAO</creatorcontrib><creatorcontrib>YI NINGBO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GAN FENG</au><au>MA CHUNPING</au><au>WU YANCHENG</au><au>ZHANG YANGFAN</au><au>LIAN MANYU</au><au>HUANG GUOTAO</au><au>YI NINGBO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyimide polymer as well as preparation method and application thereof</title><date>2023-08-01</date><risdate>2023</risdate><abstract>The invention discloses a polyimide polymer as well as a preparation method and application thereof. The polyimide polymer has a structure as shown in a formula (I), wherein n ranges from 50 to 500; r1 is selected from H and C1-3 alkyl groups; r2 is selected from-OR3 groups which are monosubstituted or polysubstituted, and R3 is selected from at least one of the groups. A large-volume siloxane side group is introduced into the structural formula of the polyimide polymer. A PI main chain has a triphenylmethane structure, so that the heat-resistant and mechanical properties are excellent. On the other hand, due to introduction of siloxane side groups, the stacking density of molecular chains and formation of charge transfer compounds (CTCs) can be remarkably reduced, and the dielectric property, the light transmittance and the solubility of the prepared PI film are all improved.
本发明公开了一种聚酰亚胺聚合物及其制备方法和应用，其聚酰亚胺聚合物具有式(Ⅰ)所示的结构：其中n的范围为50～500；R1选自H、C1～3的烷基；R2选自-OR3基团为单取代或多取代，所述R3选自中的至少一种。本发明的聚酰亚胺聚合物的结构式中引入了大体积的硅氧烷侧基。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Polyimide polymer as well as preparation method and application thereof |
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