Display module, manufacturing method of display module and display device
The embodiment of the invention provides a display module, a manufacturing method of the display module and a display device.The display module comprises a display panel, a back film, a supporting assembly, an NFC module and a circuit board, and the back film is arranged on the side away from the li...
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creator | HUANG WEN SU JINGCHANG WANG JIAHUA WU JIANJUN CHENG HAO BI XIANLEI BI XIN FAN QIANG |
description | The embodiment of the invention provides a display module, a manufacturing method of the display module and a display device.The display module comprises a display panel, a back film, a supporting assembly, an NFC module and a circuit board, and the back film is arranged on the side away from the light emitting face of the display panel; the supporting assembly is arranged on the side, away from the display panel, of the back film, and a through hole is formed in the supporting assembly; the NFC module is arranged on the side, away from the light emitting face, of the supporting assembly. The circuit board is arranged on the side, away from the light emitting face, of the NFC module, the circuit board comprises a first part attached to the NFC module, the first part is an insulating part, the circuit board further comprises a second part not attached to the NFC module, and the second part at least comprises a conductive part opposite to the through hole; and a conductive connecting piece penetrating through t |
format | Patent |
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The circuit board is arranged on the side, away from the light emitting face, of the NFC module, the circuit board comprises a first part attached to the NFC module, the first part is an insulating part, the circuit board further comprises a second part not attached to the NFC module, and the second part at least comprises a conductive part opposite to the through hole; and a conductive connecting piece penetrating through t</description><language>chi ; eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230721&DB=EPODOC&CC=CN&NR=116471869A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230721&DB=EPODOC&CC=CN&NR=116471869A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG WEN</creatorcontrib><creatorcontrib>SU JINGCHANG</creatorcontrib><creatorcontrib>WANG JIAHUA</creatorcontrib><creatorcontrib>WU JIANJUN</creatorcontrib><creatorcontrib>CHENG HAO</creatorcontrib><creatorcontrib>BI XIANLEI</creatorcontrib><creatorcontrib>BI XIN</creatorcontrib><creatorcontrib>FAN QIANG</creatorcontrib><title>Display module, manufacturing method of display module and display device</title><description>The embodiment of the invention provides a display module, a manufacturing method of the display module and a display device.The display module comprises a display panel, a back film, a supporting assembly, an NFC module and a circuit board, and the back film is arranged on the side away from the light emitting face of the display panel; the supporting assembly is arranged on the side, away from the display panel, of the back film, and a through hole is formed in the supporting assembly; the NFC module is arranged on the side, away from the light emitting face, of the supporting assembly. The circuit board is arranged on the side, away from the light emitting face, of the NFC module, the circuit board comprises a first part attached to the NFC module, the first part is an insulating part, the circuit board further comprises a second part not attached to the NFC module, and the second part at least comprises a conductive part opposite to the through hole; and a conductive connecting piece penetrating through t</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB0ySwuyEmsVMjNTynNSdVRyE3MK01LTC4pLcrMS1fITS3JyE9RyE9TSEFRp5CYlwIXSkkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoZmJuaGFmaWjsbEqAEA7K80zQ</recordid><startdate>20230721</startdate><enddate>20230721</enddate><creator>HUANG WEN</creator><creator>SU JINGCHANG</creator><creator>WANG JIAHUA</creator><creator>WU JIANJUN</creator><creator>CHENG HAO</creator><creator>BI XIANLEI</creator><creator>BI XIN</creator><creator>FAN QIANG</creator><scope>EVB</scope></search><sort><creationdate>20230721</creationdate><title>Display module, manufacturing method of display module and display device</title><author>HUANG WEN ; SU JINGCHANG ; WANG JIAHUA ; WU JIANJUN ; CHENG HAO ; BI XIANLEI ; BI XIN ; FAN QIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116471869A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG WEN</creatorcontrib><creatorcontrib>SU JINGCHANG</creatorcontrib><creatorcontrib>WANG JIAHUA</creatorcontrib><creatorcontrib>WU JIANJUN</creatorcontrib><creatorcontrib>CHENG HAO</creatorcontrib><creatorcontrib>BI XIANLEI</creatorcontrib><creatorcontrib>BI XIN</creatorcontrib><creatorcontrib>FAN QIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG WEN</au><au>SU JINGCHANG</au><au>WANG JIAHUA</au><au>WU JIANJUN</au><au>CHENG HAO</au><au>BI XIANLEI</au><au>BI XIN</au><au>FAN QIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Display module, manufacturing method of display module and display device</title><date>2023-07-21</date><risdate>2023</risdate><abstract>The embodiment of the invention provides a display module, a manufacturing method of the display module and a display device.The display module comprises a display panel, a back film, a supporting assembly, an NFC module and a circuit board, and the back film is arranged on the side away from the light emitting face of the display panel; the supporting assembly is arranged on the side, away from the display panel, of the back film, and a through hole is formed in the supporting assembly; the NFC module is arranged on the side, away from the light emitting face, of the supporting assembly. The circuit board is arranged on the side, away from the light emitting face, of the NFC module, the circuit board comprises a first part attached to the NFC module, the first part is an insulating part, the circuit board further comprises a second part not attached to the NFC module, and the second part at least comprises a conductive part opposite to the through hole; and a conductive connecting piece penetrating through t</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Display module, manufacturing method of display module and display device |
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