LED packaging structure and packaging method thereof
The invention discloses an LED packaging structure and a packaging method thereof, and relates to the field of LED packaging, the LED packaging structure comprises a substrate and a lamp strip, grooves are formed in the substrate at intervals, the lamp strip is longitudinally arranged in the middle...
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| creator | LAI JUNJIANG TANG ZIYAN ZHAO WENCHONG |
| description | The invention discloses an LED packaging structure and a packaging method thereof, and relates to the field of LED packaging, the LED packaging structure comprises a substrate and a lamp strip, grooves are formed in the substrate at intervals, the lamp strip is longitudinally arranged in the middle of the grooves of the substrate, LED chips on the lamp strip face the bottom surfaces of the grooves, reflective layers are sprayed into the grooves, and the reflective layers face the bottom surfaces of the grooves. The top surface of the substrate is provided with a resin film layer which is recessed towards the bottom surface of the groove, the resin film layer is provided with a resin layer, and the top surface of the resin layer is provided with a protective layer. The groove structure is arranged on the substrate, the resin film is covered above the substrate and the lamp strip, the resin film protrudes towards the groove direction by using an air pressure difference method, then the resin is injected above t |
| format | Patent |
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The top surface of the substrate is provided with a resin film layer which is recessed towards the bottom surface of the groove, the resin film layer is provided with a resin layer, and the top surface of the resin layer is provided with a protective layer. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LED packaging structure and packaging method thereof |
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