Micro-corrosive liquid and application of micro-corrosive liquid in displaying Cu-Ni interface boundary of elemental metal coating
The invention provides a micro-corrosive liquid and application thereof in displaying a boundary line of a Cu-Ni interface of a simple substance metal plating, the micro-corrosive liquid comprises a hydrogen peroxide solution with the mass-volume percentage concentration of 2.5%-15%, and the boundar...
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| creator | DAI BAOYE DONG SHUAI FANG YINGLONG WANG XIUTING ZHANG JINXIN XU YANCAI |
| description | The invention provides a micro-corrosive liquid and application thereof in displaying a boundary line of a Cu-Ni interface of a simple substance metal plating, the micro-corrosive liquid comprises a hydrogen peroxide solution with the mass-volume percentage concentration of 2.5%-15%, and the boundary line of the Cu-Ni interface of the simple substance metal plating can be clearly displayed by utilizing the diluted hydrogen peroxide solution. According to the present invention, the metal coating thickness can be accurately measured so as to reduce the SEM image measurement error, and the micro-corrosion liquid has characteristics of simple component, medical hydrogen peroxide replacement, low price, safe corrosion operation, less harm, long storage time, and wide application prospect.
本发明提供一种微腐蚀液及其在显现单质金属镀层Cu-Ni交界面分界线中的应用，所述微腐蚀液包括质量体积百分比浓度为2.5％-15％的双氧水溶液，利用稀的双氧水溶液能够使得在单质金属镀层Cu-Ni交界面分界线清晰地呈现出来，以便能够对于金属镀层厚度进行准确测量，降低了SEM图像测量误差，本发明的微腐蚀液成分简单，可用医用双氧水进行替代，价格便宜，腐蚀操作安全，危害较小，保存时间长，具有广阔应用前景。 |
| format | Patent |
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本发明提供一种微腐蚀液及其在显现单质金属镀层Cu-Ni交界面分界线中的应用，所述微腐蚀液包括质量体积百分比浓度为2.5％-15％的双氧水溶液，利用稀的双氧水溶液能够使得在单质金属镀层Cu-Ni交界面分界线清晰地呈现出来，以便能够对于金属镀层厚度进行准确测量，降低了SEM图像测量误差，本发明的微腐蚀液成分简单，可用医用双氧水进行替代，价格便宜，腐蚀操作安全，危害较小，保存时间长，具有广阔应用前景。</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230707&DB=EPODOC&CC=CN&NR=116399655A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230707&DB=EPODOC&CC=CN&NR=116399655A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAI BAOYE</creatorcontrib><creatorcontrib>DONG SHUAI</creatorcontrib><creatorcontrib>FANG YINGLONG</creatorcontrib><creatorcontrib>WANG XIUTING</creatorcontrib><creatorcontrib>ZHANG JINXIN</creatorcontrib><creatorcontrib>XU YANCAI</creatorcontrib><title>Micro-corrosive liquid and application of micro-corrosive liquid in displaying Cu-Ni interface boundary of elemental metal coating</title><description>The invention provides a micro-corrosive liquid and application thereof in displaying a boundary line of a Cu-Ni interface of a simple substance metal plating, the micro-corrosive liquid comprises a hydrogen peroxide solution with the mass-volume percentage concentration of 2.5%-15%, and the boundary line of the Cu-Ni interface of the simple substance metal plating can be clearly displayed by utilizing the diluted hydrogen peroxide solution. According to the present invention, the metal coating thickness can be accurately measured so as to reduce the SEM image measurement error, and the micro-corrosion liquid has characteristics of simple component, medical hydrogen peroxide replacement, low price, safe corrosion operation, less harm, long storage time, and wide application prospect.
本发明提供一种微腐蚀液及其在显现单质金属镀层Cu-Ni交界面分界线中的应用，所述微腐蚀液包括质量体积百分比浓度为2.5％-15％的双氧水溶液，利用稀的双氧水溶液能够使得在单质金属镀层Cu-Ni交界面分界线清晰地呈现出来，以便能够对于金属镀层厚度进行准确测量，降低了SEM图像测量误差，本发明的微腐蚀液成分简单，可用医用双氧水进行替代，价格便宜，腐蚀操作安全，危害较小，保存时间长，具有广阔应用前景。</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwkAQRNNYiPoP6wekCCGBlHIoNqayD-dlExYuu-fdRUjrl3sBSwuLmYHh8bbZ-0bGS27Eewn0QrD0nKkHzSnOWTI6kjDIANNvkhh6Cs7qhXgENectpS-iH7RBeMjMvfbLKkCLE3LUFiZc20hy87jPNoO2AQ_f3WXHy_murjk66TC4pGGMnWqLoi6bpq6qU_kP8wEi7Ep1</recordid><startdate>20230707</startdate><enddate>20230707</enddate><creator>DAI BAOYE</creator><creator>DONG SHUAI</creator><creator>FANG YINGLONG</creator><creator>WANG XIUTING</creator><creator>ZHANG JINXIN</creator><creator>XU YANCAI</creator><scope>EVB</scope></search><sort><creationdate>20230707</creationdate><title>Micro-corrosive liquid and application of micro-corrosive liquid in displaying Cu-Ni interface boundary of elemental metal coating</title><author>DAI BAOYE ; DONG SHUAI ; FANG YINGLONG ; WANG XIUTING ; ZHANG JINXIN ; XU YANCAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116399655A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DAI BAOYE</creatorcontrib><creatorcontrib>DONG SHUAI</creatorcontrib><creatorcontrib>FANG YINGLONG</creatorcontrib><creatorcontrib>WANG XIUTING</creatorcontrib><creatorcontrib>ZHANG JINXIN</creatorcontrib><creatorcontrib>XU YANCAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAI BAOYE</au><au>DONG SHUAI</au><au>FANG YINGLONG</au><au>WANG XIUTING</au><au>ZHANG JINXIN</au><au>XU YANCAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Micro-corrosive liquid and application of micro-corrosive liquid in displaying Cu-Ni interface boundary of elemental metal coating</title><date>2023-07-07</date><risdate>2023</risdate><abstract>The invention provides a micro-corrosive liquid and application thereof in displaying a boundary line of a Cu-Ni interface of a simple substance metal plating, the micro-corrosive liquid comprises a hydrogen peroxide solution with the mass-volume percentage concentration of 2.5%-15%, and the boundary line of the Cu-Ni interface of the simple substance metal plating can be clearly displayed by utilizing the diluted hydrogen peroxide solution. According to the present invention, the metal coating thickness can be accurately measured so as to reduce the SEM image measurement error, and the micro-corrosion liquid has characteristics of simple component, medical hydrogen peroxide replacement, low price, safe corrosion operation, less harm, long storage time, and wide application prospect.
本发明提供一种微腐蚀液及其在显现单质金属镀层Cu-Ni交界面分界线中的应用，所述微腐蚀液包括质量体积百分比浓度为2.5％-15％的双氧水溶液，利用稀的双氧水溶液能够使得在单质金属镀层Cu-Ni交界面分界线清晰地呈现出来，以便能够对于金属镀层厚度进行准确测量，降低了SEM图像测量误差，本发明的微腐蚀液成分简单，可用医用双氧水进行替代，价格便宜，腐蚀操作安全，危害较小，保存时间长，具有广阔应用前景。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PHYSICS TESTING |
| title | Micro-corrosive liquid and application of micro-corrosive liquid in displaying Cu-Ni interface boundary of elemental metal coating |
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