Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler
The semiconductor refrigerator with the hydrophilic coating comprises a semiconductor refrigeration sheet and is characterized in that a refrigeration block is arranged at the cold end of the semiconductor refrigeration sheet, and a heat dissipation block is arranged at the hot end of the semiconduc...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LING QIJIN TENG SHIZHENG WANG LICHUN MENG YONGYUN BI WENWEN ZHOU BIN WANG HUILIANG TAO SHUAI |
| description | The semiconductor refrigerator with the hydrophilic coating comprises a semiconductor refrigeration sheet and is characterized in that a refrigeration block is arranged at the cold end of the semiconductor refrigeration sheet, and a heat dissipation block is arranged at the hot end of the semiconductor refrigeration sheet; the refrigeration block is provided with a set of refrigeration fins, and the heat dissipation block is provided with a set of heat dissipation fins. And hydrophilic coatings are arranged on the surfaces of the refrigeration fins and the heat dissipation fins. Due to the design of the hydrophilic layer, water drops condensed on the heat exchange sheets by moisture in hot air are easy to spread and flow downwards along the sheets, the situation that the ventilation effect of the heat exchanger is affected due to bridging of the water drops between the heat exchange sheets is avoided, and therefore the heat exchange rate is increased; the corrosion resistance of the whole heat exchanger is im |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116399048A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116399048A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116399048A3</originalsourceid><addsrcrecordid>eNrjZIgPTs3NTM7PSylNLskvUkjOz89JLVIozyzJUMioTCnKL8jIzMlMBoonlmTmpSsk5qUo5CbmlaYlJpeUFoFECoryk1OLixXy0xSKsRjFw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDc2MLS0NTCwcjYlRAwAnbD45</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler</title><source>esp@cenet</source><creator>LING QIJIN ; TENG SHIZHENG ; WANG LICHUN ; MENG YONGYUN ; BI WENWEN ; ZHOU BIN ; WANG HUILIANG ; TAO SHUAI</creator><creatorcontrib>LING QIJIN ; TENG SHIZHENG ; WANG LICHUN ; MENG YONGYUN ; BI WENWEN ; ZHOU BIN ; WANG HUILIANG ; TAO SHUAI</creatorcontrib><description>The semiconductor refrigerator with the hydrophilic coating comprises a semiconductor refrigeration sheet and is characterized in that a refrigeration block is arranged at the cold end of the semiconductor refrigeration sheet, and a heat dissipation block is arranged at the hot end of the semiconductor refrigeration sheet; the refrigeration block is provided with a set of refrigeration fins, and the heat dissipation block is provided with a set of heat dissipation fins. And hydrophilic coatings are arranged on the surfaces of the refrigeration fins and the heat dissipation fins. Due to the design of the hydrophilic layer, water drops condensed on the heat exchange sheets by moisture in hot air are easy to spread and flow downwards along the sheets, the situation that the ventilation effect of the heat exchanger is affected due to bridging of the water drops between the heat exchange sheets is avoided, and therefore the heat exchange rate is increased; the corrosion resistance of the whole heat exchanger is im</description><language>chi ; eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BLASTING ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; SPRAYING OR ATOMISING IN GENERAL ; STEAM OR VAPOUR CONDENSERS ; TRANSPORTING ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230707&DB=EPODOC&CC=CN&NR=116399048A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230707&DB=EPODOC&CC=CN&NR=116399048A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LING QIJIN</creatorcontrib><creatorcontrib>TENG SHIZHENG</creatorcontrib><creatorcontrib>WANG LICHUN</creatorcontrib><creatorcontrib>MENG YONGYUN</creatorcontrib><creatorcontrib>BI WENWEN</creatorcontrib><creatorcontrib>ZHOU BIN</creatorcontrib><creatorcontrib>WANG HUILIANG</creatorcontrib><creatorcontrib>TAO SHUAI</creatorcontrib><title>Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler</title><description>The semiconductor refrigerator with the hydrophilic coating comprises a semiconductor refrigeration sheet and is characterized in that a refrigeration block is arranged at the cold end of the semiconductor refrigeration sheet, and a heat dissipation block is arranged at the hot end of the semiconductor refrigeration sheet; the refrigeration block is provided with a set of refrigeration fins, and the heat dissipation block is provided with a set of heat dissipation fins. And hydrophilic coatings are arranged on the surfaces of the refrigeration fins and the heat dissipation fins. Due to the design of the hydrophilic layer, water drops condensed on the heat exchange sheets by moisture in hot air are easy to spread and flow downwards along the sheets, the situation that the ventilation effect of the heat exchanger is affected due to bridging of the water drops between the heat exchange sheets is avoided, and therefore the heat exchange rate is increased; the corrosion resistance of the whole heat exchanger is im</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BLASTING</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>STEAM OR VAPOUR CONDENSERS</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgPTs3NTM7PSylNLskvUkjOz89JLVIozyzJUMioTCnKL8jIzMlMBoonlmTmpSsk5qUo5CbmlaYlJpeUFoFECoryk1OLixXy0xSKsRjFw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDc2MLS0NTCwcjYlRAwAnbD45</recordid><startdate>20230707</startdate><enddate>20230707</enddate><creator>LING QIJIN</creator><creator>TENG SHIZHENG</creator><creator>WANG LICHUN</creator><creator>MENG YONGYUN</creator><creator>BI WENWEN</creator><creator>ZHOU BIN</creator><creator>WANG HUILIANG</creator><creator>TAO SHUAI</creator><scope>EVB</scope></search><sort><creationdate>20230707</creationdate><title>Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler</title><author>LING QIJIN ; TENG SHIZHENG ; WANG LICHUN ; MENG YONGYUN ; BI WENWEN ; ZHOU BIN ; WANG HUILIANG ; TAO SHUAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116399048A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BLASTING</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>STEAM OR VAPOUR CONDENSERS</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LING QIJIN</creatorcontrib><creatorcontrib>TENG SHIZHENG</creatorcontrib><creatorcontrib>WANG LICHUN</creatorcontrib><creatorcontrib>MENG YONGYUN</creatorcontrib><creatorcontrib>BI WENWEN</creatorcontrib><creatorcontrib>ZHOU BIN</creatorcontrib><creatorcontrib>WANG HUILIANG</creatorcontrib><creatorcontrib>TAO SHUAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LING QIJIN</au><au>TENG SHIZHENG</au><au>WANG LICHUN</au><au>MENG YONGYUN</au><au>BI WENWEN</au><au>ZHOU BIN</au><au>WANG HUILIANG</au><au>TAO SHUAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler</title><date>2023-07-07</date><risdate>2023</risdate><abstract>The semiconductor refrigerator with the hydrophilic coating comprises a semiconductor refrigeration sheet and is characterized in that a refrigeration block is arranged at the cold end of the semiconductor refrigeration sheet, and a heat dissipation block is arranged at the hot end of the semiconductor refrigeration sheet; the refrigeration block is provided with a set of refrigeration fins, and the heat dissipation block is provided with a set of heat dissipation fins. And hydrophilic coatings are arranged on the surfaces of the refrigeration fins and the heat dissipation fins. Due to the design of the hydrophilic layer, water drops condensed on the heat exchange sheets by moisture in hot air are easy to spread and flow downwards along the sheets, the situation that the ventilation effect of the heat exchanger is affected due to bridging of the water drops between the heat exchange sheets is avoided, and therefore the heat exchange rate is increased; the corrosion resistance of the whole heat exchanger is im</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN116399048A |
| source | esp@cenet |
| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SPRAYING OR ATOMISING IN GENERAL STEAM OR VAPOUR CONDENSERS TRANSPORTING WEAPONS |
| title | Semiconductor cooler with hydrophilic coating and manufacturing process of semiconductor cooler |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T06%3A05%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LING%20QIJIN&rft.date=2023-07-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116399048A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |