Mechanical part polishing device
The mechanical part polishing device comprises a base, a polishing mechanism and a fixing mechanism are arranged at the top of the base, a protection mechanism is arranged between the polishing mechanism and the fixing mechanism, a cleaning mechanism is arranged on the back face of the fixing mechan...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | ZENG YUANBIN XIE SHIGEN GUO BICHANG ZENG XIANGHONG ZENG XIANHAI |
description | The mechanical part polishing device comprises a base, a polishing mechanism and a fixing mechanism are arranged at the top of the base, a protection mechanism is arranged between the polishing mechanism and the fixing mechanism, a cleaning mechanism is arranged on the back face of the fixing mechanism, and a blowing mechanism is arranged on the back face of the polishing mechanism; vertical plates are arranged on the two sides of the top of the base, a forward and reverse screw rod driven by a motor I is arranged between the two sets of vertical plates, and the forward and reverse screw rod drives the grinding mechanism and the fixing mechanism to move so as to change the distance between the grinding mechanism and the fixing mechanism. According to the device, multiple sets of products can be machined at the same time so as to improve the efficiency, machining chippings can be well protected and collected, and the problems that the environment is affected due to chipping sputtering, and the chippings are no |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116372737A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116372737A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116372737A3</originalsourceid><addsrcrecordid>eNrjZFDwTU3OSMzLTE7MUShILCpRKMjPySzOyMxLV0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZsbmRubG5o7GxKgBAFPOJUo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Mechanical part polishing device</title><source>esp@cenet</source><creator>ZENG YUANBIN ; XIE SHIGEN ; GUO BICHANG ; ZENG XIANGHONG ; ZENG XIANHAI</creator><creatorcontrib>ZENG YUANBIN ; XIE SHIGEN ; GUO BICHANG ; ZENG XIANGHONG ; ZENG XIANHAI</creatorcontrib><description>The mechanical part polishing device comprises a base, a polishing mechanism and a fixing mechanism are arranged at the top of the base, a protection mechanism is arranged between the polishing mechanism and the fixing mechanism, a cleaning mechanism is arranged on the back face of the fixing mechanism, and a blowing mechanism is arranged on the back face of the polishing mechanism; vertical plates are arranged on the two sides of the top of the base, a forward and reverse screw rod driven by a motor I is arranged between the two sets of vertical plates, and the forward and reverse screw rod drives the grinding mechanism and the fixing mechanism to move so as to change the distance between the grinding mechanism and the fixing mechanism. According to the device, multiple sets of products can be machined at the same time so as to improve the efficiency, machining chippings can be well protected and collected, and the problems that the environment is affected due to chipping sputtering, and the chippings are no</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230704&DB=EPODOC&CC=CN&NR=116372737A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230704&DB=EPODOC&CC=CN&NR=116372737A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG YUANBIN</creatorcontrib><creatorcontrib>XIE SHIGEN</creatorcontrib><creatorcontrib>GUO BICHANG</creatorcontrib><creatorcontrib>ZENG XIANGHONG</creatorcontrib><creatorcontrib>ZENG XIANHAI</creatorcontrib><title>Mechanical part polishing device</title><description>The mechanical part polishing device comprises a base, a polishing mechanism and a fixing mechanism are arranged at the top of the base, a protection mechanism is arranged between the polishing mechanism and the fixing mechanism, a cleaning mechanism is arranged on the back face of the fixing mechanism, and a blowing mechanism is arranged on the back face of the polishing mechanism; vertical plates are arranged on the two sides of the top of the base, a forward and reverse screw rod driven by a motor I is arranged between the two sets of vertical plates, and the forward and reverse screw rod drives the grinding mechanism and the fixing mechanism to move so as to change the distance between the grinding mechanism and the fixing mechanism. According to the device, multiple sets of products can be machined at the same time so as to improve the efficiency, machining chippings can be well protected and collected, and the problems that the environment is affected due to chipping sputtering, and the chippings are no</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwTU3OSMzLTE7MUShILCpRKMjPySzOyMxLV0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZsbmRubG5o7GxKgBAFPOJUo</recordid><startdate>20230704</startdate><enddate>20230704</enddate><creator>ZENG YUANBIN</creator><creator>XIE SHIGEN</creator><creator>GUO BICHANG</creator><creator>ZENG XIANGHONG</creator><creator>ZENG XIANHAI</creator><scope>EVB</scope></search><sort><creationdate>20230704</creationdate><title>Mechanical part polishing device</title><author>ZENG YUANBIN ; XIE SHIGEN ; GUO BICHANG ; ZENG XIANGHONG ; ZENG XIANHAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116372737A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG YUANBIN</creatorcontrib><creatorcontrib>XIE SHIGEN</creatorcontrib><creatorcontrib>GUO BICHANG</creatorcontrib><creatorcontrib>ZENG XIANGHONG</creatorcontrib><creatorcontrib>ZENG XIANHAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG YUANBIN</au><au>XIE SHIGEN</au><au>GUO BICHANG</au><au>ZENG XIANGHONG</au><au>ZENG XIANHAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mechanical part polishing device</title><date>2023-07-04</date><risdate>2023</risdate><abstract>The mechanical part polishing device comprises a base, a polishing mechanism and a fixing mechanism are arranged at the top of the base, a protection mechanism is arranged between the polishing mechanism and the fixing mechanism, a cleaning mechanism is arranged on the back face of the fixing mechanism, and a blowing mechanism is arranged on the back face of the polishing mechanism; vertical plates are arranged on the two sides of the top of the base, a forward and reverse screw rod driven by a motor I is arranged between the two sets of vertical plates, and the forward and reverse screw rod drives the grinding mechanism and the fixing mechanism to move so as to change the distance between the grinding mechanism and the fixing mechanism. According to the device, multiple sets of products can be machined at the same time so as to improve the efficiency, machining chippings can be well protected and collected, and the problems that the environment is affected due to chipping sputtering, and the chippings are no</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN116372737A |
source | esp@cenet |
subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
title | Mechanical part polishing device |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T07%3A17%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZENG%20YUANBIN&rft.date=2023-07-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116372737A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |