Film removing equipment

An apparatus for separating a lens wafer from a first pad, comprising: at least one air nozzle comprising a first open end facing an edge of the lens wafer and configured to spray a gas, at least one air nozzle disposed near a first lens wafer holder configured to hold a lens wafer, the lens wafer h...

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Hauptverfasser:	BOUSSIER PIERRE, DILLINGER MARKUS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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creator	BOUSSIER PIERRE DILLINGER MARKUS
description	An apparatus for separating a lens wafer from a first pad, comprising: at least one air nozzle comprising a first open end facing an edge of the lens wafer and configured to spray a gas, at least one air nozzle disposed near a first lens wafer holder configured to hold a lens wafer, the lens wafer having a first pad attached to a first surface of the lens wafer; a first peeling apparatus, the first peeling apparatus including: a second lens wafer holder configured to hold a lens wafer, and a second lens wafer holder configured to hold a second lens wafer; a first auxiliary air nozzle facing the lens wafer and including a first opening configured to spray a gas; and at least one first suction cup configured to contact the first pad on the first surface of the lens wafer and form a vacuum seal with the first pad, each suction cup of the at least one first suction cup being retractable in a direction away from the lens wafer. 一种用于将透镜晶片与第一衬垫分离的设备，包括：至少一个空气喷嘴，所述至少一个空气喷嘴包括面向透镜晶片的边缘的第一开口端并且被配置成喷射气体，所述至少一个空气喷嘴设置在被配置成
format	Patent
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a first peeling apparatus, the first peeling apparatus including: a second lens wafer holder configured to hold a lens wafer, and a second lens wafer holder configured to hold a second lens wafer; a first auxiliary air nozzle facing the lens wafer and including a first opening configured to spray a gas; and at least one first suction cup configured to contact the first pad on the first surface of the lens wafer and form a vacuum seal with the first pad, each suction cup of the at least one first suction cup being retractable in a direction away from the lens wafer. 一种用于将透镜晶片与第一衬垫分离的设备，包括：至少一个空气喷嘴，所述至少一个空气喷嘴包括面向透镜晶片的边缘的第一开口端并且被配置成喷射气体，所述至少一个空气喷嘴设置在被配置成</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230630&DB=EPODOC&CC=CN&NR=116367960A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230630&DB=EPODOC&CC=CN&NR=116367960A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOUSSIER PIERRE</creatorcontrib><creatorcontrib>DILLINGER MARKUS</creatorcontrib><title>Film removing equipment</title><description>An apparatus for separating a lens wafer from a first pad, comprising: at least one air nozzle comprising a first open end facing an edge of the lens wafer and configured to spray a gas, at least one air nozzle disposed near a first lens wafer holder configured to hold a lens wafer, the lens wafer having a first pad attached to a first surface of the lens wafer; a first peeling apparatus, the first peeling apparatus including: a second lens wafer holder configured to hold a lens wafer, and a second lens wafer holder configured to hold a second lens wafer; a first auxiliary air nozzle facing the lens wafer and including a first opening configured to spray a gas; and at least one first suction cup configured to contact the first pad on the first surface of the lens wafer and form a vacuum seal with the first pad, each suction cup of the at least one first suction cup being retractable in a direction away from the lens wafer. 一种用于将透镜晶片与第一衬垫分离的设备，包括：至少一个空气喷嘴，所述至少一个空气喷嘴包括面向透镜晶片的边缘的第一开口端并且被配置成喷射气体，所述至少一个空气喷嘴设置在被配置成</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB3y8zJVShKzc0vy8xLV0gtLM0syE3NK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZsZm5pZmBo7GxKgBANZYIhM</recordid><startdate>20230630</startdate><enddate>20230630</enddate><creator>BOUSSIER PIERRE</creator><creator>DILLINGER MARKUS</creator><scope>EVB</scope></search><sort><creationdate>20230630</creationdate><title>Film removing equipment</title><author>BOUSSIER PIERRE ; DILLINGER MARKUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116367960A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>BOUSSIER PIERRE</creatorcontrib><creatorcontrib>DILLINGER MARKUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOUSSIER PIERRE</au><au>DILLINGER MARKUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Film removing equipment</title><date>2023-06-30</date><risdate>2023</risdate><abstract>An apparatus for separating a lens wafer from a first pad, comprising: at least one air nozzle comprising a first open end facing an edge of the lens wafer and configured to spray a gas, at least one air nozzle disposed near a first lens wafer holder configured to hold a lens wafer, the lens wafer having a first pad attached to a first surface of the lens wafer; a first peeling apparatus, the first peeling apparatus including: a second lens wafer holder configured to hold a lens wafer, and a second lens wafer holder configured to hold a second lens wafer; a first auxiliary air nozzle facing the lens wafer and including a first opening configured to spray a gas; and at least one first suction cup configured to contact the first pad on the first surface of the lens wafer and form a vacuum seal with the first pad, each suction cup of the at least one first suction cup being retractable in a direction away from the lens wafer. 一种用于将透镜晶片与第一衬垫分离的设备，包括：至少一个空气喷嘴，所述至少一个空气喷嘴包括面向透镜晶片的边缘的第一开口端并且被配置成喷射气体，所述至少一个空气喷嘴设置在被配置成</abstract><oa>free_for_read</oa></addata></record>
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language	chi ; eng
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subjects	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
title	Film removing equipment
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T02%3A41%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BOUSSIER%20PIERRE&rft.date=2023-06-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116367960A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true