Liquid metal interconnect for modular encapsulated server architecture

An electronic device and an associated method are disclosed. In one example, an electronic device includes an integrated circuit (IC) package substrate including a package interconnect and a first substrate surface; a processor IC attached to the first substrate surface and electrically connected to the package interconnect; a liquid metal well array comprising a plurality of liquid metal wells, a first array surface attached to the first substrate surface, and a second array surface; and a companion component to the processor IC attached to the second array surface of the liquid metal well array. 公开了一种电子器件和相关联的方法。在一个示例中，一种电子器件包括集成电路(IC)封装衬底，其包括封装互连和第一衬底表面；处理器IC，其附接到第一衬底表面并且电连接到封装互连；液态金属阱阵列，其包括多个液态金属阱、附接到第一衬底表面的第一阵列表面和第二阵列表面；以及对处理器IC的同伴组件，其附接到液态金属阱阵列的第二阵列表面。