Packaging structure capable of preventing components from being polluted by glue and packaging method thereof
The invention discloses a packaging structure and a packaging method for preventing components from being polluted by glue, the packaging structure comprises a substrate and a heat dissipation cover, the heat dissipation cover covers the substrate, a chip is arranged on the substrate, an SR groove i...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | XIE XIANYU |
| description | The invention discloses a packaging structure and a packaging method for preventing components from being polluted by glue, the packaging structure comprises a substrate and a heat dissipation cover, the heat dissipation cover covers the substrate, a chip is arranged on the substrate, an SR groove is arranged on the surface of the substrate and near the chip, a heat dissipation cover groove is arranged on a contact area of the heat dissipation cover and the chip, and the SR groove is arranged on the surface of the heat dissipation cover. The edge of the heat dissipation cover is provided with a heat dissipation cover blocking step, the edge of the substrate is provided with AD glue, the AD glue can be clamped by the heat dissipation cover blocking step and the SR step, the top of the chip is provided with Timm glue, and the Timm glue can be embedded into the heat dissipation cover groove. According to the invention, the heat dissipation glue is used as the retaining wall, the groove of the heat dissipation co |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116314064A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116314064A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116314064A3</originalsourceid><addsrcrecordid>eNqNjLEKwjAYhLs4iPoOvw8gWFq6S1GcxMG9pOmlikn-kPwRfHtbEGen4-67u2Xhrko_1fjwIyWJWUuOIK2C6i2IDYWIF7zMXLML7CeTyER21GNOA1ubBQP1bxptBik_UPidOsidB5I7Itisi4VRNmHz1VWxPR1v7XmHwB3SNIOHdO2lLJuqrPdNfaj-6XwAu3hCkw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging structure capable of preventing components from being polluted by glue and packaging method thereof</title><source>esp@cenet</source><creator>XIE XIANYU</creator><creatorcontrib>XIE XIANYU</creatorcontrib><description>The invention discloses a packaging structure and a packaging method for preventing components from being polluted by glue, the packaging structure comprises a substrate and a heat dissipation cover, the heat dissipation cover covers the substrate, a chip is arranged on the substrate, an SR groove is arranged on the surface of the substrate and near the chip, a heat dissipation cover groove is arranged on a contact area of the heat dissipation cover and the chip, and the SR groove is arranged on the surface of the heat dissipation cover. The edge of the heat dissipation cover is provided with a heat dissipation cover blocking step, the edge of the substrate is provided with AD glue, the AD glue can be clamped by the heat dissipation cover blocking step and the SR step, the top of the chip is provided with Timm glue, and the Timm glue can be embedded into the heat dissipation cover groove. According to the invention, the heat dissipation glue is used as the retaining wall, the groove of the heat dissipation co</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230623&DB=EPODOC&CC=CN&NR=116314064A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230623&DB=EPODOC&CC=CN&NR=116314064A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE XIANYU</creatorcontrib><title>Packaging structure capable of preventing components from being polluted by glue and packaging method thereof</title><description>The invention discloses a packaging structure and a packaging method for preventing components from being polluted by glue, the packaging structure comprises a substrate and a heat dissipation cover, the heat dissipation cover covers the substrate, a chip is arranged on the substrate, an SR groove is arranged on the surface of the substrate and near the chip, a heat dissipation cover groove is arranged on a contact area of the heat dissipation cover and the chip, and the SR groove is arranged on the surface of the heat dissipation cover. The edge of the heat dissipation cover is provided with a heat dissipation cover blocking step, the edge of the substrate is provided with AD glue, the AD glue can be clamped by the heat dissipation cover blocking step and the SR step, the top of the chip is provided with Timm glue, and the Timm glue can be embedded into the heat dissipation cover groove. According to the invention, the heat dissipation glue is used as the retaining wall, the groove of the heat dissipation co</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAYhLs4iPoOvw8gWFq6S1GcxMG9pOmlikn-kPwRfHtbEGen4-67u2Xhrko_1fjwIyWJWUuOIK2C6i2IDYWIF7zMXLML7CeTyER21GNOA1ubBQP1bxptBik_UPidOsidB5I7Itisi4VRNmHz1VWxPR1v7XmHwB3SNIOHdO2lLJuqrPdNfaj-6XwAu3hCkw</recordid><startdate>20230623</startdate><enddate>20230623</enddate><creator>XIE XIANYU</creator><scope>EVB</scope></search><sort><creationdate>20230623</creationdate><title>Packaging structure capable of preventing components from being polluted by glue and packaging method thereof</title><author>XIE XIANYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116314064A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XIE XIANYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIE XIANYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging structure capable of preventing components from being polluted by glue and packaging method thereof</title><date>2023-06-23</date><risdate>2023</risdate><abstract>The invention discloses a packaging structure and a packaging method for preventing components from being polluted by glue, the packaging structure comprises a substrate and a heat dissipation cover, the heat dissipation cover covers the substrate, a chip is arranged on the substrate, an SR groove is arranged on the surface of the substrate and near the chip, a heat dissipation cover groove is arranged on a contact area of the heat dissipation cover and the chip, and the SR groove is arranged on the surface of the heat dissipation cover. The edge of the heat dissipation cover is provided with a heat dissipation cover blocking step, the edge of the substrate is provided with AD glue, the AD glue can be clamped by the heat dissipation cover blocking step and the SR step, the top of the chip is provided with Timm glue, and the Timm glue can be embedded into the heat dissipation cover groove. According to the invention, the heat dissipation glue is used as the retaining wall, the groove of the heat dissipation co</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN116314064A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging structure capable of preventing components from being polluted by glue and packaging method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T05%3A36%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XIE%20XIANYU&rft.date=2023-06-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116314064A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |