Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device

The invention provides a virtual tactile conduction assembly, a wearable glove and a virtual tactile interaction device. The virtual tactile conduction assembly is used for the virtual tactile interaction device and structurally comprises at least one conduction piece, the conduction piece is a rigi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUANG LEI, WU YOU, WANG YUAN, ZHANG XIUJIAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HUANG LEI
WU YOU
WANG YUAN
ZHANG XIUJIAO
description The invention provides a virtual tactile conduction assembly, a wearable glove and a virtual tactile interaction device. The virtual tactile conduction assembly is used for the virtual tactile interaction device and structurally comprises at least one conduction piece, the conduction piece is a rigid body and is provided with a tactile input part, a connecting part and a tactile output part, one end of the connecting part is connected to the tactile input part, the other end of the connecting part is connected to the tactile output part, and the tactile input part is provided with a stress face. The stress surface is configured to receive a tactile signal formed by ultrasonic focusing, the tactile output part is provided with a force transmission surface, the force transmission surface is located on the side, away from the stress surface, of the conduction piece, and the area of the force transmission surface is smaller than that of the stress surface. The virtual tactile conduction assembly provided by the i
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116263621A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116263621A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116263621A3</originalsourceid><addsrcrecordid>eNrjZIgKyywqKU3MUShJTC7JzElVSM7PSykFMvPzFBKLi1Nzk3IqdRTKUxOLEpOAsuk5-WWpCol5KQplaPoy80pSixIhGlNSyzKTU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhmZGZsZmRoaMxMWoAdh87mA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device</title><source>esp@cenet</source><creator>HUANG LEI ; WU YOU ; WANG YUAN ; ZHANG XIUJIAO</creator><creatorcontrib>HUANG LEI ; WU YOU ; WANG YUAN ; ZHANG XIUJIAO</creatorcontrib><description>The invention provides a virtual tactile conduction assembly, a wearable glove and a virtual tactile interaction device. The virtual tactile conduction assembly is used for the virtual tactile interaction device and structurally comprises at least one conduction piece, the conduction piece is a rigid body and is provided with a tactile input part, a connecting part and a tactile output part, one end of the connecting part is connected to the tactile input part, the other end of the connecting part is connected to the tactile output part, and the tactile input part is provided with a stress face. The stress surface is configured to receive a tactile signal formed by ultrasonic focusing, the tactile output part is provided with a force transmission surface, the force transmission surface is located on the side, away from the stress surface, of the conduction piece, and the area of the force transmission surface is smaller than that of the stress surface. The virtual tactile conduction assembly provided by the i</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230616&amp;DB=EPODOC&amp;CC=CN&amp;NR=116263621A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230616&amp;DB=EPODOC&amp;CC=CN&amp;NR=116263621A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG LEI</creatorcontrib><creatorcontrib>WU YOU</creatorcontrib><creatorcontrib>WANG YUAN</creatorcontrib><creatorcontrib>ZHANG XIUJIAO</creatorcontrib><title>Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device</title><description>The invention provides a virtual tactile conduction assembly, a wearable glove and a virtual tactile interaction device. The virtual tactile conduction assembly is used for the virtual tactile interaction device and structurally comprises at least one conduction piece, the conduction piece is a rigid body and is provided with a tactile input part, a connecting part and a tactile output part, one end of the connecting part is connected to the tactile input part, the other end of the connecting part is connected to the tactile output part, and the tactile input part is provided with a stress face. The stress surface is configured to receive a tactile signal formed by ultrasonic focusing, the tactile output part is provided with a force transmission surface, the force transmission surface is located on the side, away from the stress surface, of the conduction piece, and the area of the force transmission surface is smaller than that of the stress surface. The virtual tactile conduction assembly provided by the i</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgKyywqKU3MUShJTC7JzElVSM7PSykFMvPzFBKLi1Nzk3IqdRTKUxOLEpOAsuk5-WWpCol5KQplaPoy80pSixIhGlNSyzKTU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhmZGZsZmRoaMxMWoAdh87mA</recordid><startdate>20230616</startdate><enddate>20230616</enddate><creator>HUANG LEI</creator><creator>WU YOU</creator><creator>WANG YUAN</creator><creator>ZHANG XIUJIAO</creator><scope>EVB</scope></search><sort><creationdate>20230616</creationdate><title>Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device</title><author>HUANG LEI ; WU YOU ; WANG YUAN ; ZHANG XIUJIAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116263621A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG LEI</creatorcontrib><creatorcontrib>WU YOU</creatorcontrib><creatorcontrib>WANG YUAN</creatorcontrib><creatorcontrib>ZHANG XIUJIAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG LEI</au><au>WU YOU</au><au>WANG YUAN</au><au>ZHANG XIUJIAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device</title><date>2023-06-16</date><risdate>2023</risdate><abstract>The invention provides a virtual tactile conduction assembly, a wearable glove and a virtual tactile interaction device. The virtual tactile conduction assembly is used for the virtual tactile interaction device and structurally comprises at least one conduction piece, the conduction piece is a rigid body and is provided with a tactile input part, a connecting part and a tactile output part, one end of the connecting part is connected to the tactile input part, the other end of the connecting part is connected to the tactile output part, and the tactile input part is provided with a stress face. The stress surface is configured to receive a tactile signal formed by ultrasonic focusing, the tactile output part is provided with a force transmission surface, the force transmission surface is located on the side, away from the stress surface, of the conduction piece, and the area of the force transmission surface is smaller than that of the stress surface. The virtual tactile conduction assembly provided by the i</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN116263621A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title Virtual tactile conduction assembly, wearable glove and virtual tactile interaction device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T17%3A00%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20LEI&rft.date=2023-06-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116263621A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true