System for testing packaging effect of photon counting detector
The invention discloses a system for testing the packaging effect of a photon counting detector. The photon counting detector comprises a photon detection element, an adapter plate and a photon counting integrated circuit board. The first connecting line is arranged on the photon detection element a...
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creator | XIAO HAOYANG YANG RIGUI SONG GUANQIANG YU GONGCHI XIONG YANCHUN LI YUHONG |
description | The invention discloses a system for testing the packaging effect of a photon counting detector. The photon counting detector comprises a photon detection element, an adapter plate and a photon counting integrated circuit board. The first connecting line is arranged on the photon detection element and is connected with a bonding pad on the photon detection element, and the second connecting line is arranged on the photon counting integrated circuit board and is connected with a bonding pad on the photon counting integrated circuit board. The first connecting circuit is connected with a bonding pad on the first surface of the adapter plate, the second connecting circuit is connected with a bonding pad on the second surface of the adapter plate, the bonding pad on the first surface of the adapter plate is electrically connected with the bonding pad on the second surface, and the first connecting circuit, the second connecting circuit and the bonding pad, connected with the first connecting circuit and the secon |
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The photon counting detector comprises a photon detection element, an adapter plate and a photon counting integrated circuit board. The first connecting line is arranged on the photon detection element and is connected with a bonding pad on the photon detection element, and the second connecting line is arranged on the photon counting integrated circuit board and is connected with a bonding pad on the photon counting integrated circuit board. 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The first connecting circuit is connected with a bonding pad on the first surface of the adapter plate, the second connecting circuit is connected with a bonding pad on the second surface of the adapter plate, the bonding pad on the first surface of the adapter plate is electrically connected with the bonding pad on the second surface, and the first connecting circuit, the second connecting circuit and the bonding pad, connected with the first connecting circuit and the secon</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPriwuSc1VSMsvUihJLS7JzEtXKEhMzk5MB7FS09JSk0sU8tMUCjLyS_LzFJLzS_PAalJSS4Ay-UU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61GGhUal5qSbyzn6GhmZGpmZm5oaMxMWoArqsxNg</recordid><startdate>20230613</startdate><enddate>20230613</enddate><creator>XIAO HAOYANG</creator><creator>YANG RIGUI</creator><creator>SONG GUANQIANG</creator><creator>YU GONGCHI</creator><creator>XIONG YANCHUN</creator><creator>LI YUHONG</creator><scope>EVB</scope></search><sort><creationdate>20230613</creationdate><title>System for testing packaging effect of photon counting detector</title><author>XIAO HAOYANG ; YANG RIGUI ; SONG GUANQIANG ; YU GONGCHI ; XIONG YANCHUN ; LI YUHONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116256671A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>XIAO HAOYANG</creatorcontrib><creatorcontrib>YANG RIGUI</creatorcontrib><creatorcontrib>SONG GUANQIANG</creatorcontrib><creatorcontrib>YU GONGCHI</creatorcontrib><creatorcontrib>XIONG YANCHUN</creatorcontrib><creatorcontrib>LI YUHONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIAO HAOYANG</au><au>YANG RIGUI</au><au>SONG GUANQIANG</au><au>YU GONGCHI</au><au>XIONG YANCHUN</au><au>LI YUHONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System for testing packaging effect of photon counting detector</title><date>2023-06-13</date><risdate>2023</risdate><abstract>The invention discloses a system for testing the packaging effect of a photon counting detector. 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language | chi ; eng |
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subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
title | System for testing packaging effect of photon counting detector |
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