Composition and method for flatting surfaces

提供一种平整或抛光表面的组合物及以该组合物平整或抛光表面的方法。此组合物包含约5-90重量％发烟金属氧化物及约10-95重量％磨蚀粒子，其中约90％或更多磨蚀粒子(以数目为基准)的粒径不超过100毫微米。本发明组合物可以高抛光效率、均匀度及去除率和最少缺陷，如最少下层结构及地形上的场损失用于平整或抛光表面。 A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % o...

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Bibliographische Detailangaben
1. Verfasser:	BRIAN L. MUELLER,JAMES A. DIRKSEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	提供一种平整或抛光表面的组合物及以该组合物平整或抛光表面的方法。此组合物包含约5-90重量％发烟金属氧化物及约10-95重量％磨蚀粒子，其中约90％或更多磨蚀粒子(以数目为基准)的粒径不超过100毫微米。本发明组合物可以高抛光效率、均匀度及去除率和最少缺陷，如最少下层结构及地形上的场损失用于平整或抛光表面。 A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.