Mobile electronic device
The invention provides mobile electronic equipment. The mobile electronic equipment comprises a circuit board; a first device comprising a first magnetic member; a second device comprising a second magnetic member; a first metal member configured to shield the magnetic force generated by the first m...
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| creator | KIM HONG-JUN LEE JAE-HWAN LIM JAE-DEOK LEE KI-HOON SON WANG-IK KANG SEUNGGOO KIM YONGHWA CHOI SEUNG-BUM |
| description | The invention provides mobile electronic equipment. The mobile electronic equipment comprises a circuit board; a first device comprising a first magnetic member; a second device comprising a second magnetic member; a first metal member configured to shield the magnetic force generated by the first magnetic member from the second device; and a second metal member configured to support the circuit board, where the first metal member is disposed between the first device and the second device in a vertical standing orientation relative to the circuit board, where the first metal member and the second metal member are attached to each other, and wherein the first metal member is formed of a metal material different from the metal material forming the second metal member.
本公开提供一种移动电子设备，其包括：电路板；第一装置，包括第一磁性构件；第二装置，包括第二磁性构件；第一金属构件，配置为将由第一磁性构件产生的磁力与第二装置屏蔽开；以及第二金属构件，配置为支撑电路板，其中第一金属构件设置在第一装置和第二装置之间处于相对于电路板的垂直站立取向，其中第一金属构件和第二金属构件彼此附接，以及其中第一金属构件由与形成第二金属构件的金属材料不同的金属材料形成。 |
| format | Patent |
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本公开提供一种移动电子设备，其包括：电路板；第一装置，包括第一磁性构件；第二装置，包括第二磁性构件；第一金属构件，配置为将由第一磁性构件产生的磁力与第二装置屏蔽开；以及第二金属构件，配置为支撑电路板，其中第一金属构件设置在第一装置和第二装置之间处于相对于电路板的垂直站立取向，其中第一金属构件和第二金属构件彼此附接，以及其中第一金属构件由与形成第二金属构件的金属材料不同的金属材料形成。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230606&DB=EPODOC&CC=CN&NR=116234286A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230606&DB=EPODOC&CC=CN&NR=116234286A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM HONG-JUN</creatorcontrib><creatorcontrib>LEE JAE-HWAN</creatorcontrib><creatorcontrib>LIM JAE-DEOK</creatorcontrib><creatorcontrib>LEE KI-HOON</creatorcontrib><creatorcontrib>SON WANG-IK</creatorcontrib><creatorcontrib>KANG SEUNGGOO</creatorcontrib><creatorcontrib>KIM YONGHWA</creatorcontrib><creatorcontrib>CHOI SEUNG-BUM</creatorcontrib><title>Mobile electronic device</title><description>The invention provides mobile electronic equipment. The mobile electronic equipment comprises a circuit board; a first device comprising a first magnetic member; a second device comprising a second magnetic member; a first metal member configured to shield the magnetic force generated by the first magnetic member from the second device; and a second metal member configured to support the circuit board, where the first metal member is disposed between the first device and the second device in a vertical standing orientation relative to the circuit board, where the first metal member and the second metal member are attached to each other, and wherein the first metal member is formed of a metal material different from the metal material forming the second metal member.
本公开提供一种移动电子设备，其包括：电路板；第一装置，包括第一磁性构件；第二装置，包括第二磁性构件；第一金属构件，配置为将由第一磁性构件产生的磁力与第二装置屏蔽开；以及第二金属构件，配置为支撑电路板，其中第一金属构件设置在第一装置和第二装置之间处于相对于电路板的垂直站立取向，其中第一金属构件和第二金属构件彼此附接，以及其中第一金属构件由与形成第二金属构件的金属材料不同的金属材料形成。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwzU_KzElVSM1JTS4pys_LTFZISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhmZGxiZGFmaOxsSoAQDsmSIx</recordid><startdate>20230606</startdate><enddate>20230606</enddate><creator>KIM HONG-JUN</creator><creator>LEE JAE-HWAN</creator><creator>LIM JAE-DEOK</creator><creator>LEE KI-HOON</creator><creator>SON WANG-IK</creator><creator>KANG SEUNGGOO</creator><creator>KIM YONGHWA</creator><creator>CHOI SEUNG-BUM</creator><scope>EVB</scope></search><sort><creationdate>20230606</creationdate><title>Mobile electronic device</title><author>KIM HONG-JUN ; LEE JAE-HWAN ; LIM JAE-DEOK ; LEE KI-HOON ; SON WANG-IK ; KANG SEUNGGOO ; KIM YONGHWA ; CHOI SEUNG-BUM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116234286A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM HONG-JUN</creatorcontrib><creatorcontrib>LEE JAE-HWAN</creatorcontrib><creatorcontrib>LIM JAE-DEOK</creatorcontrib><creatorcontrib>LEE KI-HOON</creatorcontrib><creatorcontrib>SON WANG-IK</creatorcontrib><creatorcontrib>KANG SEUNGGOO</creatorcontrib><creatorcontrib>KIM YONGHWA</creatorcontrib><creatorcontrib>CHOI SEUNG-BUM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM HONG-JUN</au><au>LEE JAE-HWAN</au><au>LIM JAE-DEOK</au><au>LEE KI-HOON</au><au>SON WANG-IK</au><au>KANG SEUNGGOO</au><au>KIM YONGHWA</au><au>CHOI SEUNG-BUM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mobile electronic device</title><date>2023-06-06</date><risdate>2023</risdate><abstract>The invention provides mobile electronic equipment. The mobile electronic equipment comprises a circuit board; a first device comprising a first magnetic member; a second device comprising a second magnetic member; a first metal member configured to shield the magnetic force generated by the first magnetic member from the second device; and a second metal member configured to support the circuit board, where the first metal member is disposed between the first device and the second device in a vertical standing orientation relative to the circuit board, where the first metal member and the second metal member are attached to each other, and wherein the first metal member is formed of a metal material different from the metal material forming the second metal member.
本公开提供一种移动电子设备，其包括：电路板；第一装置，包括第一磁性构件；第二装置，包括第二磁性构件；第一金属构件，配置为将由第一磁性构件产生的磁力与第二装置屏蔽开；以及第二金属构件，配置为支撑电路板，其中第一金属构件设置在第一装置和第二装置之间处于相对于电路板的垂直站立取向，其中第一金属构件和第二金属构件彼此附接，以及其中第一金属构件由与形成第二金属构件的金属材料不同的金属材料形成。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Mobile electronic device |
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