Dielectric paste and preparation method thereof
The invention discloses dielectric paste and a preparation method thereof, and belongs to the technical field of electronic materials, and the dielectric paste comprises the following components in percentage by mass: 10-20% of an organic carrier, 60-80% of glass powder and 1-10% of a modified addit...
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| creator | XU DI DONG PENGCHENG YANG YAN GAO HUI DING DERUI |
| description | The invention discloses dielectric paste and a preparation method thereof, and belongs to the technical field of electronic materials, and the dielectric paste comprises the following components in percentage by mass: 10-20% of an organic carrier, 60-80% of glass powder and 1-10% of a modified additive, the organic carrier comprises the following components in percentage by mass: 50-70% of photosensitive resin, 3-5% of a photocuring prepolymer, 3-5% of a photocuring monomer, 3-5% of a photoinitiator, 15-25% of a solvent, 0.3-2% of a flatting agent, 0.3-2% of a defoaming agent and 0.3-2% of a dispersing agent; the molecular structure of the photosensitive resin contains a photosensitive group and an alkali-soluble group. The dielectric paste with excellent performance is prepared by taking the organic carrier, the glass powder and the modified additive as raw materials, and the dielectric paste has excellent dielectric constant, insulating property and stability and can stably exist in an acid system.
本发明公开了一种 |
| format | Patent |
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本发明公开了一种</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230602&DB=EPODOC&CC=CN&NR=116206800A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230602&DB=EPODOC&CC=CN&NR=116206800A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU DI</creatorcontrib><creatorcontrib>DONG PENGCHENG</creatorcontrib><creatorcontrib>YANG YAN</creatorcontrib><creatorcontrib>GAO HUI</creatorcontrib><creatorcontrib>DING DERUI</creatorcontrib><title>Dielectric paste and preparation method thereof</title><description>The invention discloses dielectric paste and a preparation method thereof, and belongs to the technical field of electronic materials, and the dielectric paste comprises the following components in percentage by mass: 10-20% of an organic carrier, 60-80% of glass powder and 1-10% of a modified additive, the organic carrier comprises the following components in percentage by mass: 50-70% of photosensitive resin, 3-5% of a photocuring prepolymer, 3-5% of a photocuring monomer, 3-5% of a photoinitiator, 15-25% of a solvent, 0.3-2% of a flatting agent, 0.3-2% of a defoaming agent and 0.3-2% of a dispersing agent; the molecular structure of the photosensitive resin contains a photosensitive group and an alkali-soluble group. The dielectric paste with excellent performance is prepared by taking the organic carrier, the glass powder and the modified additive as raw materials, and the dielectric paste has excellent dielectric constant, insulating property and stability and can stably exist in an acid system.
本发明公开了一种</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3yUzNSU0uKcpMVihILC5JVUjMS1EoKEotSCxKLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZkYGZhYGBo7GxKgBADpGKwE</recordid><startdate>20230602</startdate><enddate>20230602</enddate><creator>XU DI</creator><creator>DONG PENGCHENG</creator><creator>YANG YAN</creator><creator>GAO HUI</creator><creator>DING DERUI</creator><scope>EVB</scope></search><sort><creationdate>20230602</creationdate><title>Dielectric paste and preparation method thereof</title><author>XU DI ; DONG PENGCHENG ; YANG YAN ; GAO HUI ; DING DERUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116206800A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>XU DI</creatorcontrib><creatorcontrib>DONG PENGCHENG</creatorcontrib><creatorcontrib>YANG YAN</creatorcontrib><creatorcontrib>GAO HUI</creatorcontrib><creatorcontrib>DING DERUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU DI</au><au>DONG PENGCHENG</au><au>YANG YAN</au><au>GAO HUI</au><au>DING DERUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Dielectric paste and preparation method thereof</title><date>2023-06-02</date><risdate>2023</risdate><abstract>The invention discloses dielectric paste and a preparation method thereof, and belongs to the technical field of electronic materials, and the dielectric paste comprises the following components in percentage by mass: 10-20% of an organic carrier, 60-80% of glass powder and 1-10% of a modified additive, the organic carrier comprises the following components in percentage by mass: 50-70% of photosensitive resin, 3-5% of a photocuring prepolymer, 3-5% of a photocuring monomer, 3-5% of a photoinitiator, 15-25% of a solvent, 0.3-2% of a flatting agent, 0.3-2% of a defoaming agent and 0.3-2% of a dispersing agent; the molecular structure of the photosensitive resin contains a photosensitive group and an alkali-soluble group. The dielectric paste with excellent performance is prepared by taking the organic carrier, the glass powder and the modified additive as raw materials, and the dielectric paste has excellent dielectric constant, insulating property and stability and can stably exist in an acid system.
本发明公开了一种</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | Dielectric paste and preparation method thereof |
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