Circuit board

A circuit board comprises an insulating substrate layer, a grounding layer, an insulating layer, an insulating through hole, a signal transmission layer and a polymer conductor. The grounding layer is located between the insulating layer and the insulating substrate layer. The signal transmission la...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN YANJUN, JIAN RUIHONG, CHEN YANGZHONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A circuit board comprises an insulating substrate layer, a grounding layer, an insulating layer, an insulating through hole, a signal transmission layer and a polymer conductor. The grounding layer is located between the insulating layer and the insulating substrate layer. The signal transmission layer is located on one surface of the insulating layer back to the ground layer. The insulating through hole penetrates through the signal transmission layer and the insulating layer and is connected with the grounding layer. A part of the polymer conductor is electrically connected with the grounding layer, and the other part of the polymer conductor extends out of the insulating through hole. Therefore, through the structure, the manufacturing process is simplified, the operation time is shortened, and the manufacturing cost and the material cost are also saved. 一种电路板包含绝缘基板层、接地层、绝缘层、绝缘穿孔、信号传输层与高分子导电体。接地层位于绝缘层与绝缘基板层之间。信号传输层位于绝缘层背对接地层的一面。绝缘穿孔贯穿信号传输层及绝缘层,且连接接地层。高分子导电体位于绝缘穿孔内,其一部分电连接接地层,另一部分伸出绝缘穿孔之外。如此,通过以上架构,不仅简化制造流程