Hot melt adhesive for polyolefin films
The invention relates to a hot melt adhesive containing a) 25 to 95% by weight, preferably 50 to 85% by weight, of at least one polyolefin-based polymer; b) 1 to 75 wt%, preferably 1 to 40 wt%, of at least one tackifying resin; c) 0 to 15 wt% of at least one plasticizer; and d) 0 to 30% by weight of...
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Format: | Patent |
Sprache: | chi ; eng |
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