Polyisoimide as well as preparation method and application thereof
The invention discloses polyisoimide and a preparation method and application thereof.The structural formula of the polyisoimide is shown in the formula I, the dissolved solid content of the polyisoimide in a polar high-boiling-point solvent is higher than 60%, negative photosensitive polyimide comp...
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| creator | CHEN XINZHUN WU YIHONG ZHANG BIN XU LIUJING RUAN YUNQING ZHANG ZUHUA CHEN XUNJUN |
| description | The invention discloses polyisoimide and a preparation method and application thereof.The structural formula of the polyisoimide is shown in the formula I, the dissolved solid content of the polyisoimide in a polar high-boiling-point solvent is higher than 60%, negative photosensitive polyimide compositions with different viscosities can be prepared according to different solid contents, the coating thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m, and the thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m. After the coating is developed and thermally cured, a negative pattern with the depth-to-width ratio larger than 2.5 and the minimum line width of 10-20 m can be realized, and the film retention rate is higher than 85%.
本发明公开了一种聚异酰亚胺及其制备方法和应用，本发明的聚异酰亚胺，其结构式如式I所示其在极性高沸点溶剂中溶解固含量高于60%，根据不同的固含量可制备不同黏度的负性光敏聚酰亚胺组合物，其旋涂后涂层厚度范围在0.5µm~100µm，涂层在经显影、热固化过程步骤后，可实现深宽比大于2.5，最小线宽为10µm~20µm的负性图案，其留膜率高于85%。 |
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本发明公开了一种聚异酰亚胺及其制备方法和应用，本发明的聚异酰亚胺，其结构式如式I所示其在极性高沸点溶剂中溶解固含量高于60%，根据不同的固含量可制备不同黏度的负性光敏聚酰亚胺组合物，其旋涂后涂层厚度范围在0.5µm~100µm，涂层在经显影、热固化过程步骤后，可实现深宽比大于2.5，最小线宽为10µm~20µm的负性图案，其留膜率高于85%。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230530&DB=EPODOC&CC=CN&NR=116178716A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230530&DB=EPODOC&CC=CN&NR=116178716A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN XINZHUN</creatorcontrib><creatorcontrib>WU YIHONG</creatorcontrib><creatorcontrib>ZHANG BIN</creatorcontrib><creatorcontrib>XU LIUJING</creatorcontrib><creatorcontrib>RUAN YUNQING</creatorcontrib><creatorcontrib>ZHANG ZUHUA</creatorcontrib><creatorcontrib>CHEN XUNJUN</creatorcontrib><title>Polyisoimide as well as preparation method and application thereof</title><description>The invention discloses polyisoimide and a preparation method and application thereof.The structural formula of the polyisoimide is shown in the formula I, the dissolved solid content of the polyisoimide in a polar high-boiling-point solvent is higher than 60%, negative photosensitive polyimide compositions with different viscosities can be prepared according to different solid contents, the coating thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m, and the thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m. After the coating is developed and thermally cured, a negative pattern with the depth-to-width ratio larger than 2.5 and the minimum line width of 10-20 m can be realized, and the film retention rate is higher than 85%.
本发明公开了一种聚异酰亚胺及其制备方法和应用，本发明的聚异酰亚胺，其结构式如式I所示其在极性高沸点溶剂中溶解固含量高于60%，根据不同的固含量可制备不同黏度的负性光敏聚酰亚胺组合物，其旋涂后涂层厚度范围在0.5µm~100µm，涂层在经显影、热固化过程步骤后，可实现深宽比大于2.5，最小线宽为10µm~20µm的负性图案，其留膜率高于85%。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKyM-pzCzOz8zNTElVSCxWKE_NyQHRBUWpBYlFiSWZ-XkKuaklGfkpCol5QFxQkJOZDBEuyUgtSs1P42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoZmhuYW5oZmjsbEqAEAYxQyYg</recordid><startdate>20230530</startdate><enddate>20230530</enddate><creator>CHEN XINZHUN</creator><creator>WU YIHONG</creator><creator>ZHANG BIN</creator><creator>XU LIUJING</creator><creator>RUAN YUNQING</creator><creator>ZHANG ZUHUA</creator><creator>CHEN XUNJUN</creator><scope>EVB</scope></search><sort><creationdate>20230530</creationdate><title>Polyisoimide as well as preparation method and application thereof</title><author>CHEN XINZHUN ; WU YIHONG ; ZHANG BIN ; XU LIUJING ; RUAN YUNQING ; ZHANG ZUHUA ; CHEN XUNJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116178716A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN XINZHUN</creatorcontrib><creatorcontrib>WU YIHONG</creatorcontrib><creatorcontrib>ZHANG BIN</creatorcontrib><creatorcontrib>XU LIUJING</creatorcontrib><creatorcontrib>RUAN YUNQING</creatorcontrib><creatorcontrib>ZHANG ZUHUA</creatorcontrib><creatorcontrib>CHEN XUNJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN XINZHUN</au><au>WU YIHONG</au><au>ZHANG BIN</au><au>XU LIUJING</au><au>RUAN YUNQING</au><au>ZHANG ZUHUA</au><au>CHEN XUNJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyisoimide as well as preparation method and application thereof</title><date>2023-05-30</date><risdate>2023</risdate><abstract>The invention discloses polyisoimide and a preparation method and application thereof.The structural formula of the polyisoimide is shown in the formula I, the dissolved solid content of the polyisoimide in a polar high-boiling-point solvent is higher than 60%, negative photosensitive polyimide compositions with different viscosities can be prepared according to different solid contents, the coating thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m, and the thickness range of the polyisoimide after spin coating ranges from 0.5 m to 100 m. After the coating is developed and thermally cured, a negative pattern with the depth-to-width ratio larger than 2.5 and the minimum line width of 10-20 m can be realized, and the film retention rate is higher than 85%.
本发明公开了一种聚异酰亚胺及其制备方法和应用，本发明的聚异酰亚胺，其结构式如式I所示其在极性高沸点溶剂中溶解固含量高于60%，根据不同的固含量可制备不同黏度的负性光敏聚酰亚胺组合物，其旋涂后涂层厚度范围在0.5µm~100µm，涂层在经显影、热固化过程步骤后，可实现深宽比大于2.5，最小线宽为10µm~20µm的负性图案，其留膜率高于85%。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Polyisoimide as well as preparation method and application thereof |
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