Cooling device and electronic equipment
The invention relates to a cooling device and electronic equipment. The cooling device comprises a condensation part and a sealing part, the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element; the condensation part comprise...
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| creator | PITT LI CHENG ZHAN KETUAN HU AVIATION GE YONGBO LYU HAICAI ZENG HONGBO LI YANG HAO MINGLIANG |
| description | The invention relates to a cooling device and electronic equipment. The cooling device comprises a condensation part and a sealing part, the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element; the condensation part comprises a condensation pipe and an air cooling structure used for dissipating heat of the condensation pipe. The condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe. Therefore, the working temperature of the chip can be effectively reduced by adopting phase-change heat exchange, an additional liquid cooling structure does not need to be designed and arranged, the design complexity is reduced, and the internal space of the electronic equipment is saved.
本公开是关于一种冷却装置和电子设备；冷却装置包括：冷凝部分和密封部分，其中，密封部分能够容置冷却液，冷却液能够浸没安装有发热元件的电路板；冷凝部分包括冷凝管和用于对冷凝管散热的风冷结构；冷凝管与密封部分连通；风冷结构设置于冷凝管的至少一侧。如此本公开可以采用相变换热能够有效的降低芯片工作温度，并且无需设计、布置额外的液冷结构，降低设计复杂度，节省电子设备内部空间。 |
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本公开是关于一种冷却装置和电子设备；冷却装置包括：冷凝部分和密封部分，其中，密封部分能够容置冷却液，冷却液能够浸没安装有发热元件的电路板；冷凝部分包括冷凝管和用于对冷凝管散热的风冷结构；冷凝管与密封部分连通；风冷结构设置于冷凝管的至少一侧。如此本公开可以采用相变换热能够有效的降低芯片工作温度，并且无需设计、布置额外的液冷结构，降低设计复杂度，节省电子设备内部空间。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230523&DB=EPODOC&CC=CN&NR=116156830A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230523&DB=EPODOC&CC=CN&NR=116156830A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PITT</creatorcontrib><creatorcontrib>LI CHENG</creatorcontrib><creatorcontrib>ZHAN KETUAN</creatorcontrib><creatorcontrib>HU AVIATION</creatorcontrib><creatorcontrib>GE YONGBO</creatorcontrib><creatorcontrib>LYU HAICAI</creatorcontrib><creatorcontrib>ZENG HONGBO</creatorcontrib><creatorcontrib>LI YANG</creatorcontrib><creatorcontrib>HAO MINGLIANG</creatorcontrib><title>Cooling device and electronic equipment</title><description>The invention relates to a cooling device and electronic equipment. The cooling device comprises a condensation part and a sealing part, the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element; the condensation part comprises a condensation pipe and an air cooling structure used for dissipating heat of the condensation pipe. The condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe. Therefore, the working temperature of the chip can be effectively reduced by adopting phase-change heat exchange, an additional liquid cooling structure does not need to be designed and arranged, the design complexity is reduced, and the internal space of the electronic equipment is saved.
本公开是关于一种冷却装置和电子设备；冷却装置包括：冷凝部分和密封部分，其中，密封部分能够容置冷却液，冷却液能够浸没安装有发热元件的电路板；冷凝部分包括冷凝管和用于对冷凝管散热的风冷结构；冷凝管与密封部分连通；风冷结构设置于冷凝管的至少一侧。如此本公开可以采用相变换热能够有效的降低芯片工作温度，并且无需设计、布置额外的液冷结构，降低设计复杂度，节省电子设备内部空间。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB3zs_PycxLV0hJLctMTlVIzEtRSM1JTS4pys_LTFZILSzNLMhNzSvhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhmaGpmYWxgaOxsSoAQChWif6</recordid><startdate>20230523</startdate><enddate>20230523</enddate><creator>PITT</creator><creator>LI CHENG</creator><creator>ZHAN KETUAN</creator><creator>HU AVIATION</creator><creator>GE YONGBO</creator><creator>LYU HAICAI</creator><creator>ZENG HONGBO</creator><creator>LI YANG</creator><creator>HAO MINGLIANG</creator><scope>EVB</scope></search><sort><creationdate>20230523</creationdate><title>Cooling device and electronic equipment</title><author>PITT ; LI CHENG ; ZHAN KETUAN ; HU AVIATION ; GE YONGBO ; LYU HAICAI ; ZENG HONGBO ; LI YANG ; HAO MINGLIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116156830A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>PITT</creatorcontrib><creatorcontrib>LI CHENG</creatorcontrib><creatorcontrib>ZHAN KETUAN</creatorcontrib><creatorcontrib>HU AVIATION</creatorcontrib><creatorcontrib>GE YONGBO</creatorcontrib><creatorcontrib>LYU HAICAI</creatorcontrib><creatorcontrib>ZENG HONGBO</creatorcontrib><creatorcontrib>LI YANG</creatorcontrib><creatorcontrib>HAO MINGLIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PITT</au><au>LI CHENG</au><au>ZHAN KETUAN</au><au>HU AVIATION</au><au>GE YONGBO</au><au>LYU HAICAI</au><au>ZENG HONGBO</au><au>LI YANG</au><au>HAO MINGLIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling device and electronic equipment</title><date>2023-05-23</date><risdate>2023</risdate><abstract>The invention relates to a cooling device and electronic equipment. The cooling device comprises a condensation part and a sealing part, the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element; the condensation part comprises a condensation pipe and an air cooling structure used for dissipating heat of the condensation pipe. The condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe. Therefore, the working temperature of the chip can be effectively reduced by adopting phase-change heat exchange, an additional liquid cooling structure does not need to be designed and arranged, the design complexity is reduced, and the internal space of the electronic equipment is saved.
本公开是关于一种冷却装置和电子设备；冷却装置包括：冷凝部分和密封部分，其中，密封部分能够容置冷却液，冷却液能够浸没安装有发热元件的电路板；冷凝部分包括冷凝管和用于对冷凝管散热的风冷结构；冷凝管与密封部分连通；风冷结构设置于冷凝管的至少一侧。如此本公开可以采用相变换热能够有效的降低芯片工作温度，并且无需设计、布置额外的液冷结构，降低设计复杂度，节省电子设备内部空间。</abstract><oa>free_for_read</oa></addata></record> |
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| title | Cooling device and electronic equipment |
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