Electroplating nano-bicrystal and non-nano-bicrystal copper features

Nano-bicrystal copper and non-nano-bicrystal copper may be electroplated to form a mixed crystal structure, such as a two-in-one copper via and RDL () structure or a two-in-one copper via and pillar structure. Nanometer bicrystal copper can be electroplated on the non-nanometer bicrystal copper laye...

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Bibliographische Detailangaben

Hauptverfasser:	BUCKALEW BRYAN L, MAYER STEVEN T, BANIK STEPHEN J II, OBERST JUSTIN, PONNUSWAMI THOMAS ANAND
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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