Heat dissipation system of power module and control method thereof
The invention provides a heat dissipation system of a power module and a control method thereof.The heat dissipation system of the power module comprises a fluorine pump air conditioning system, a heat pipe system, the power module and an adjustable heat conduction module, and the heat pipe system c...
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creator | KANG JIAN LI RONG YU LEI HUANG YUYOU LIN HAIJIA LAI TAOHUI |
description | The invention provides a heat dissipation system of a power module and a control method thereof.The heat dissipation system of the power module comprises a fluorine pump air conditioning system, a heat pipe system, the power module and an adjustable heat conduction module, and the heat pipe system comprises an evaporation section and a condensation section; the condensation section can exchange heat with a refrigerant in the fluorine pump air conditioning system so as to release heat to the refrigerant, the evaporation section can exchange heat with the power module so as to absorb heat and cool the power module, and the adjustable heat conduction module is arranged between the evaporation section and the power module. The adjustable heat conduction module can increase heat transfer resistance and reduce or prevent heat exchange between the power module and the evaporation section when the fluorine pump air conditioning system operates in a fluorine pump refrigeration mode. According to the invention, the adj |
format | Patent |
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The adjustable heat conduction module can increase heat transfer resistance and reduce or prevent heat exchange between the power module and the evaporation section when the fluorine pump air conditioning system operates in a fluorine pump refrigeration mode. 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The adjustable heat conduction module can increase heat transfer resistance and reduce or prevent heat exchange between the power module and the evaporation section when the fluorine pump air conditioning system operates in a fluorine pump refrigeration mode. According to the invention, the adj</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQBuAsDlJ9h_MBCsaCuxalk5N7Cc0fGkhyIXcivr2LD-D0Ld_WXCc4JR9FYnUauZB8RJGJA1V-o1Fm_0ogVzwtXLRxogxd2ZOuaOCwM5vgkmD_szOH--05Tj0qz5DqFhToPD6sPVs7nOzxMvxzvlUpMiE</recordid><startdate>20230512</startdate><enddate>20230512</enddate><creator>KANG JIAN</creator><creator>LI RONG</creator><creator>YU LEI</creator><creator>HUANG YUYOU</creator><creator>LIN HAIJIA</creator><creator>LAI TAOHUI</creator><scope>EVB</scope></search><sort><creationdate>20230512</creationdate><title>Heat dissipation system of power module and control method thereof</title><author>KANG JIAN ; LI RONG ; YU LEI ; HUANG YUYOU ; LIN HAIJIA ; LAI TAOHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116113210A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG JIAN</creatorcontrib><creatorcontrib>LI RONG</creatorcontrib><creatorcontrib>YU LEI</creatorcontrib><creatorcontrib>HUANG YUYOU</creatorcontrib><creatorcontrib>LIN HAIJIA</creatorcontrib><creatorcontrib>LAI TAOHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG JIAN</au><au>LI RONG</au><au>YU LEI</au><au>HUANG YUYOU</au><au>LIN HAIJIA</au><au>LAI TAOHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat dissipation system of power module and control method thereof</title><date>2023-05-12</date><risdate>2023</risdate><abstract>The invention provides a heat dissipation system of a power module and a control method thereof.The heat dissipation system of the power module comprises a fluorine pump air conditioning system, a heat pipe system, the power module and an adjustable heat conduction module, and the heat pipe system comprises an evaporation section and a condensation section; the condensation section can exchange heat with a refrigerant in the fluorine pump air conditioning system so as to release heat to the refrigerant, the evaporation section can exchange heat with the power module so as to absorb heat and cool the power module, and the adjustable heat conduction module is arranged between the evaporation section and the power module. 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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Heat dissipation system of power module and control method thereof |
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