Haptic structure for providing haptic output at electronic device
The present disclosure provides haptic structures for providing haptic output at an electronic device. Embodiments relate to an electronic device including a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below and offset from the cover, a spa...
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| creator | HENDREN KEITH J KAO YU-LONG WANG XIAOFEI ARMENDARIZ KEVIN C LEHMANN ANDREW J PONKALA JUKKA ILMARI |
| description | The present disclosure provides haptic structures for providing haptic output at an electronic device. Embodiments relate to an electronic device including a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device may also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.
本公开提供用于在电子设备处提供触觉输出的触觉结构。实施方案涉及一种电子设备，该电子设备包括盖和定位在盖下方的触觉模块。触觉模块包括定位在盖下方并且偏离盖的基板，定位在基板与盖之间并且将基板耦接到盖的间隔件，以及定位在基板的表面上并偏离盖以限定压电元件与盖之间的间隙的压电元件。电子设备还可包括耦接到盖并且被配置为检测输入的传感器，以及能够操作地耦接到压电元件并且被 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116107389A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116107389A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116107389A3</originalsourceid><addsrcrecordid>eNrjZHD0SCwoyUxWKC4pKk0uKS1KVUjLL1IoKMovy0zJzEtXyIBI55eWFJSWKCSWKKTmpCaXFOXnAQVTUssyk1N5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hoZmhgbmxhaWjMTFqAEEgMio</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Haptic structure for providing haptic output at electronic device</title><source>esp@cenet</source><creator>HENDREN KEITH J ; KAO YU-LONG ; WANG XIAOFEI ; ARMENDARIZ KEVIN C ; LEHMANN ANDREW J ; PONKALA JUKKA ILMARI</creator><creatorcontrib>HENDREN KEITH J ; KAO YU-LONG ; WANG XIAOFEI ; ARMENDARIZ KEVIN C ; LEHMANN ANDREW J ; PONKALA JUKKA ILMARI</creatorcontrib><description>The present disclosure provides haptic structures for providing haptic output at an electronic device. Embodiments relate to an electronic device including a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device may also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.
本公开提供用于在电子设备处提供触觉输出的触觉结构。实施方案涉及一种电子设备，该电子设备包括盖和定位在盖下方的触觉模块。触觉模块包括定位在盖下方并且偏离盖的基板，定位在基板与盖之间并且将基板耦接到盖的间隔件，以及定位在基板的表面上并偏离盖以限定压电元件与盖之间的间隙的压电元件。电子设备还可包括耦接到盖并且被配置为检测输入的传感器，以及能够操作地耦接到压电元件并且被</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230512&DB=EPODOC&CC=CN&NR=116107389A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230512&DB=EPODOC&CC=CN&NR=116107389A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HENDREN KEITH J</creatorcontrib><creatorcontrib>KAO YU-LONG</creatorcontrib><creatorcontrib>WANG XIAOFEI</creatorcontrib><creatorcontrib>ARMENDARIZ KEVIN C</creatorcontrib><creatorcontrib>LEHMANN ANDREW J</creatorcontrib><creatorcontrib>PONKALA JUKKA ILMARI</creatorcontrib><title>Haptic structure for providing haptic output at electronic device</title><description>The present disclosure provides haptic structures for providing haptic output at an electronic device. Embodiments relate to an electronic device including a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device may also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.
本公开提供用于在电子设备处提供触觉输出的触觉结构。实施方案涉及一种电子设备，该电子设备包括盖和定位在盖下方的触觉模块。触觉模块包括定位在盖下方并且偏离盖的基板，定位在基板与盖之间并且将基板耦接到盖的间隔件，以及定位在基板的表面上并偏离盖以限定压电元件与盖之间的间隙的压电元件。电子设备还可包括耦接到盖并且被配置为检测输入的传感器，以及能够操作地耦接到压电元件并且被</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0SCwoyUxWKC4pKk0uKS1KVUjLL1IoKMovy0zJzEtXyIBI55eWFJSWKCSWKKTmpCaXFOXnAQVTUssyk1N5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hoZmhgbmxhaWjMTFqAEEgMio</recordid><startdate>20230512</startdate><enddate>20230512</enddate><creator>HENDREN KEITH J</creator><creator>KAO YU-LONG</creator><creator>WANG XIAOFEI</creator><creator>ARMENDARIZ KEVIN C</creator><creator>LEHMANN ANDREW J</creator><creator>PONKALA JUKKA ILMARI</creator><scope>EVB</scope></search><sort><creationdate>20230512</creationdate><title>Haptic structure for providing haptic output at electronic device</title><author>HENDREN KEITH J ; KAO YU-LONG ; WANG XIAOFEI ; ARMENDARIZ KEVIN C ; LEHMANN ANDREW J ; PONKALA JUKKA ILMARI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116107389A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HENDREN KEITH J</creatorcontrib><creatorcontrib>KAO YU-LONG</creatorcontrib><creatorcontrib>WANG XIAOFEI</creatorcontrib><creatorcontrib>ARMENDARIZ KEVIN C</creatorcontrib><creatorcontrib>LEHMANN ANDREW J</creatorcontrib><creatorcontrib>PONKALA JUKKA ILMARI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HENDREN KEITH J</au><au>KAO YU-LONG</au><au>WANG XIAOFEI</au><au>ARMENDARIZ KEVIN C</au><au>LEHMANN ANDREW J</au><au>PONKALA JUKKA ILMARI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Haptic structure for providing haptic output at electronic device</title><date>2023-05-12</date><risdate>2023</risdate><abstract>The present disclosure provides haptic structures for providing haptic output at an electronic device. Embodiments relate to an electronic device including a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device may also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.
本公开提供用于在电子设备处提供触觉输出的触觉结构。实施方案涉及一种电子设备，该电子设备包括盖和定位在盖下方的触觉模块。触觉模块包括定位在盖下方并且偏离盖的基板，定位在基板与盖之间并且将基板耦接到盖的间隔件，以及定位在基板的表面上并偏离盖以限定压电元件与盖之间的间隙的压电元件。电子设备还可包括耦接到盖并且被配置为检测输入的传感器，以及能够操作地耦接到压电元件并且被</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
| title | Haptic structure for providing haptic output at electronic device |
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