Cleaning anti-oxidation process for preventing copper surface oxidation based on printed circuit board copper foil
The invention discloses a cleaning and anti-oxidation process for preventing a copper surface from being oxidized based on a printed circuit board copper foil. The cleaning and anti-oxidation process comprises the steps of oil removal, water washing, micro-etching, water washing again, acid pickling...
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| creator | LIU ZHENG LIU BO LIU LETONG CHEN WEICHANG |
| description | The invention discloses a cleaning and anti-oxidation process for preventing a copper surface from being oxidized based on a printed circuit board copper foil. The cleaning and anti-oxidation process comprises the steps of oil removal, water washing, micro-etching, water washing again, acid pickling, washing and drying, adsorbent spraying, anti-oxidation treatment, washing and drying again, protective layer spraying and thermocuring. The surface of the circuit board can be subjected to anti-oxidation protection, so that the anti-oxidation capability of the circuit board can be improved, in addition, an anti-oxidation adsorbent is sprayed on the surface of the circuit board by utilizing a nano spraying technology, the adsorption effect of an anti-oxidation layer can be effectively improved, and meanwhile, the anti-oxidation performance of the circuit board is improved. By spraying the nano silicon oxide protective layer on the surface of the anti-oxidation layer, the anti-oxidation layer can be protected, so t |
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The cleaning and anti-oxidation process comprises the steps of oil removal, water washing, micro-etching, water washing again, acid pickling, washing and drying, adsorbent spraying, anti-oxidation treatment, washing and drying again, protective layer spraying and thermocuring. The surface of the circuit board can be subjected to anti-oxidation protection, so that the anti-oxidation capability of the circuit board can be improved, in addition, an anti-oxidation adsorbent is sprayed on the surface of the circuit board by utilizing a nano spraying technology, the adsorption effect of an anti-oxidation layer can be effectively improved, and meanwhile, the anti-oxidation performance of the circuit board is improved. 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The cleaning and anti-oxidation process comprises the steps of oil removal, water washing, micro-etching, water washing again, acid pickling, washing and drying, adsorbent spraying, anti-oxidation treatment, washing and drying again, protective layer spraying and thermocuring. The surface of the circuit board can be subjected to anti-oxidation protection, so that the anti-oxidation capability of the circuit board can be improved, in addition, an anti-oxidation adsorbent is sprayed on the surface of the circuit board by utilizing a nano spraying technology, the adsorption effect of an anti-oxidation layer can be effectively improved, and meanwhile, the anti-oxidation performance of the circuit board is improved. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Cleaning anti-oxidation process for preventing copper surface oxidation based on printed circuit board copper foil |
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