Method for evaluating thermal expansion characteristic of surface plating layer

The invention discloses a method for evaluating thermal expansion characteristics of a surface plating layer. The method comprises the following steps: constructing a function relation alpha composite (T) between a linear expansion coefficient of a composite and temperature; the composite body compr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI YUE, YU XIANGTIAN, XING YAN, NIU HU, BAI ZHIYANG, HE DUANPENG, GAO HONG, WANG XIANGKE, LI YAN, YAO ZIYANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!