Small-angle infrared emission LED packaging device
The invention provides a small-angle infrared emission LED packaging device which comprises a packaging substrate, an infrared emission LED and an LED protection material, a sinking structure is arranged on the upper surface of the packaging substrate, the infrared emission LED is arranged in the si...
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| creator | WEI SHUILIN YU HONGYING YANG YANG WAN CHENYANG YIN JIANGTAO |
| description | The invention provides a small-angle infrared emission LED packaging device which comprises a packaging substrate, an infrared emission LED and an LED protection material, a sinking structure is arranged on the upper surface of the packaging substrate, the infrared emission LED is arranged in the sinking structure in a die bonding mode, and the LED protection material is filled in the sinking structure and covers the infrared emission LED and a bonding wire of the infrared emission LED. By arranging the sinking structure, the size of the device is further reduced, the size of the device can be smaller than or equal to 4.6 mm < 3 > and is only 15%-25% of that of a traditional convex lens packaging device, and meanwhile light can be emitted at the small angle of 2 theta 1/220-40 degrees.
本发明提供了一种小角度红外发射LED封装器件，包括：封装基底、红外发射LED及LED保护材料，其中，所述封装基底上表面配置有下沉结构，所述红外发射LED固晶于所述下沉结构内，所述LED保护材料填充于所述下沉结构内，覆盖所述红外发射LED及其焊线。其通过配置下沉结构，将器件尺寸进一步缩小，器件体积可做到≤4.6mm3，仅为传统凸透镜封装器件的15％～25％，同时能够实现2θ1/220°～40°的小角度出光。 |
| format | Patent |
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本发明提供了一种小角度红外发射LED封装器件，包括：封装基底、红外发射LED及LED保护材料，其中，所述封装基底上表面配置有下沉结构，所述红外发射LED固晶于所述下沉结构内，所述LED保护材料填充于所述下沉结构内，覆盖所述红外发射LED及其焊线。其通过配置下沉结构，将器件尺寸进一步缩小，器件体积可做到≤4.6mm3，仅为传统凸透镜封装器件的15％～25％，同时能够实现2θ1/220°～40°的小角度出光。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230502&DB=EPODOC&CC=CN&NR=116053388A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230502&DB=EPODOC&CC=CN&NR=116053388A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI SHUILIN</creatorcontrib><creatorcontrib>YU HONGYING</creatorcontrib><creatorcontrib>YANG YANG</creatorcontrib><creatorcontrib>WAN CHENYANG</creatorcontrib><creatorcontrib>YIN JIANGTAO</creatorcontrib><title>Small-angle infrared emission LED packaging device</title><description>The invention provides a small-angle infrared emission LED packaging device which comprises a packaging substrate, an infrared emission LED and an LED protection material, a sinking structure is arranged on the upper surface of the packaging substrate, the infrared emission LED is arranged in the sinking structure in a die bonding mode, and the LED protection material is filled in the sinking structure and covers the infrared emission LED and a bonding wire of the infrared emission LED. By arranging the sinking structure, the size of the device is further reduced, the size of the device can be smaller than or equal to 4.6 mm < 3 > and is only 15%-25% of that of a traditional convex lens packaging device, and meanwhile light can be emitted at the small angle of 2 theta 1/220-40 degrees.
本发明提供了一种小角度红外发射LED封装器件，包括：封装基底、红外发射LED及LED保护材料，其中，所述封装基底上表面配置有下沉结构，所述红外发射LED固晶于所述下沉结构内，所述LED保护材料填充于所述下沉结构内，覆盖所述红外发射LED及其焊线。其通过配置下沉结构，将器件尺寸进一步缩小，器件体积可做到≤4.6mm3，仅为传统凸透镜封装器件的15％～25％，同时能够实现2θ1/220°～40°的小角度出光。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKzk3MydFNzEvPSVXIzEsrSixKTVFIzc0sLs7Mz1PwcXVRKEhMzk5Mz8xLV0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQOWpeakl8c5-hoZmBqbGxhYWjsbEqAEAjtsriA</recordid><startdate>20230502</startdate><enddate>20230502</enddate><creator>WEI SHUILIN</creator><creator>YU HONGYING</creator><creator>YANG YANG</creator><creator>WAN CHENYANG</creator><creator>YIN JIANGTAO</creator><scope>EVB</scope></search><sort><creationdate>20230502</creationdate><title>Small-angle infrared emission LED packaging device</title><author>WEI SHUILIN ; YU HONGYING ; YANG YANG ; WAN CHENYANG ; YIN JIANGTAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116053388A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI SHUILIN</creatorcontrib><creatorcontrib>YU HONGYING</creatorcontrib><creatorcontrib>YANG YANG</creatorcontrib><creatorcontrib>WAN CHENYANG</creatorcontrib><creatorcontrib>YIN JIANGTAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI SHUILIN</au><au>YU HONGYING</au><au>YANG YANG</au><au>WAN CHENYANG</au><au>YIN JIANGTAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Small-angle infrared emission LED packaging device</title><date>2023-05-02</date><risdate>2023</risdate><abstract>The invention provides a small-angle infrared emission LED packaging device which comprises a packaging substrate, an infrared emission LED and an LED protection material, a sinking structure is arranged on the upper surface of the packaging substrate, the infrared emission LED is arranged in the sinking structure in a die bonding mode, and the LED protection material is filled in the sinking structure and covers the infrared emission LED and a bonding wire of the infrared emission LED. By arranging the sinking structure, the size of the device is further reduced, the size of the device can be smaller than or equal to 4.6 mm < 3 > and is only 15%-25% of that of a traditional convex lens packaging device, and meanwhile light can be emitted at the small angle of 2 theta 1/220-40 degrees.
本发明提供了一种小角度红外发射LED封装器件，包括：封装基底、红外发射LED及LED保护材料，其中，所述封装基底上表面配置有下沉结构，所述红外发射LED固晶于所述下沉结构内，所述LED保护材料填充于所述下沉结构内，覆盖所述红外发射LED及其焊线。其通过配置下沉结构，将器件尺寸进一步缩小，器件体积可做到≤4.6mm3，仅为传统凸透镜封装器件的15％～25％，同时能够实现2θ1/220°～40°的小角度出光。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Small-angle infrared emission LED packaging device |
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