Anti-breakdown double-layer PCB (Printed Circuit Board)

Anti-breakdown double-layer PCB (Printed Circuit Board)

An anti-breakdown double-layer PCB disclosed by the present invention comprises a protection frame and a circuit board body, the bottoms of the two sides of an inner cavity of the protection frame are both bolted with mounting plates, the tops of the mounting plates are provided with fixing assembli...

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1. Verfasser: ZHANG XUNHUI
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ZHANG XUNHUI
description An anti-breakdown double-layer PCB disclosed by the present invention comprises a protection frame and a circuit board body, the bottoms of the two sides of an inner cavity of the protection frame are both bolted with mounting plates, the tops of the mounting plates are provided with fixing assemblies, the front and back of the circuit board body are both provided with heat dissipation assemblies, the circuit board body comprises a substrate and an anti-static layer, and the anti-static layer is arranged on the substrate. Through cooperation of the anti-static layer, a good anti-static effect is achieved, the problem that the circuit board body is prone to being broken down by static electricity is avoided, through cooperation of a heat dissipation plate, heat dissipation fins and heat dissipation openings, heat generated by the circuit board body is dissipated, the heat dissipation performance of the circuit board is improved, and through cooperation of a threaded rod, a handle and an L-shaped plate, the hea
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116033650A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116033650A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116033650A3</originalsourceid><addsrcrecordid>eNrjZDB3zCvJ1E0qSk3MTskvz1NIyS9NyknVzUmsTC1SCHB2UtAIKMrMK0lNUXDOLEouzSxRcMpPLErR5GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoZmBsbGZqYGjsbEqAEAUAosog</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Anti-breakdown double-layer PCB (Printed Circuit Board)</title><source>esp@cenet</source><creator>ZHANG XUNHUI</creator><creatorcontrib>ZHANG XUNHUI</creatorcontrib><description>An anti-breakdown double-layer PCB disclosed by the present invention comprises a protection frame and a circuit board body, the bottoms of the two sides of an inner cavity of the protection frame are both bolted with mounting plates, the tops of the mounting plates are provided with fixing assemblies, the front and back of the circuit board body are both provided with heat dissipation assemblies, the circuit board body comprises a substrate and an anti-static layer, and the anti-static layer is arranged on the substrate. Through cooperation of the anti-static layer, a good anti-static effect is achieved, the problem that the circuit board body is prone to being broken down by static electricity is avoided, through cooperation of a heat dissipation plate, heat dissipation fins and heat dissipation openings, heat generated by the circuit board body is dissipated, the heat dissipation performance of the circuit board is improved, and through cooperation of a threaded rod, a handle and an L-shaped plate, the hea</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230428&amp;DB=EPODOC&amp;CC=CN&amp;NR=116033650A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230428&amp;DB=EPODOC&amp;CC=CN&amp;NR=116033650A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG XUNHUI</creatorcontrib><title>Anti-breakdown double-layer PCB (Printed Circuit Board)</title><description>An anti-breakdown double-layer PCB disclosed by the present invention comprises a protection frame and a circuit board body, the bottoms of the two sides of an inner cavity of the protection frame are both bolted with mounting plates, the tops of the mounting plates are provided with fixing assemblies, the front and back of the circuit board body are both provided with heat dissipation assemblies, the circuit board body comprises a substrate and an anti-static layer, and the anti-static layer is arranged on the substrate. Through cooperation of the anti-static layer, a good anti-static effect is achieved, the problem that the circuit board body is prone to being broken down by static electricity is avoided, through cooperation of a heat dissipation plate, heat dissipation fins and heat dissipation openings, heat generated by the circuit board body is dissipated, the heat dissipation performance of the circuit board is improved, and through cooperation of a threaded rod, a handle and an L-shaped plate, the hea</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3zCvJ1E0qSk3MTskvz1NIyS9NyknVzUmsTC1SCHB2UtAIKMrMK0lNUXDOLEouzSxRcMpPLErR5GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoZmBsbGZqYGjsbEqAEAUAosog</recordid><startdate>20230428</startdate><enddate>20230428</enddate><creator>ZHANG XUNHUI</creator><scope>EVB</scope></search><sort><creationdate>20230428</creationdate><title>Anti-breakdown double-layer PCB (Printed Circuit Board)</title><author>ZHANG XUNHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116033650A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG XUNHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG XUNHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Anti-breakdown double-layer PCB (Printed Circuit Board)</title><date>2023-04-28</date><risdate>2023</risdate><abstract>An anti-breakdown double-layer PCB disclosed by the present invention comprises a protection frame and a circuit board body, the bottoms of the two sides of an inner cavity of the protection frame are both bolted with mounting plates, the tops of the mounting plates are provided with fixing assemblies, the front and back of the circuit board body are both provided with heat dissipation assemblies, the circuit board body comprises a substrate and an anti-static layer, and the anti-static layer is arranged on the substrate. Through cooperation of the anti-static layer, a good anti-static effect is achieved, the problem that the circuit board body is prone to being broken down by static electricity is avoided, through cooperation of a heat dissipation plate, heat dissipation fins and heat dissipation openings, heat generated by the circuit board body is dissipated, the heat dissipation performance of the circuit board is improved, and through cooperation of a threaded rod, a handle and an L-shaped plate, the hea</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Anti-breakdown double-layer PCB (Printed Circuit Board)
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