Cooling simulation method and device, storage medium, and workpiece cooling method

The invention provides a cooling simulation method and device capable of shortening calculation time, a storage medium, and a workpiece cooling method. The cooling simulation method is a cooling simulation method that predicts a temperature change in the interior of a heated workpiece when a coolant...

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Bibliographische Detailangaben
Hauptverfasser: HORINO TAKASHI, YOSHIDA TAISHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a cooling simulation method and device capable of shortening calculation time, a storage medium, and a workpiece cooling method. The cooling simulation method is a cooling simulation method that predicts a temperature change in the interior of a heated workpiece when a coolant is brought into contact with the workpiece. In the cooling simulation method, a flow rate of a coolant on a surface of the workpiece is calculated by a flow analysis of the coolant based on thermal fluid simulation, and a temperature change inside the workpiece is calculated based on a temperature of the surface of the workpiece and the calculated flow rate. 提供能够缩短计算时间的冷却仿真方法及装置、存储介质、以及工件的冷却方法。冷却仿真方法是预测使冷却剂与加热了的工件接触了的情况下的所述工件的内部的温度变化的冷却仿真方法。在所述冷却仿真方法中,通过基于热流体仿真进行的冷却剂的流动分析,来计算所述工件的表面上的所述冷却剂的流速,基于所述工件的表面的温度及计算出的所述流速来计算所述工件的内部的温度变化。