CURABLE COMPOSITION FOR INKJET COATING AND LED PROTECTION, LED MODULE, METHOD FOR MANUFACTURING LED MODULE, AND LED DISPLAY DEVICE

The present invention provides a curable composition for inkjet coating and LED protection, which is capable of satisfactorily maintaining the shape of an edge portion of a coated object when the curable composition is applied to at least one of a gap between a plurality of LED chips and an upper po...

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Hauptverfasser: INOUE TAKANORI, FUJITA YOSHITO, KUROSU MITSUHO, TANIKAWA MITSURU, WATANABE TAKASHI, UEDA MICHIHISA
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creator INOUE TAKANORI
FUJITA YOSHITO
KUROSU MITSUHO
TANIKAWA MITSURU
WATANABE TAKASHI
UEDA MICHIHISA
description The present invention provides a curable composition for inkjet coating and LED protection, which is capable of satisfactorily maintaining the shape of an edge portion of a coated object when the curable composition is applied to at least one of a gap between a plurality of LED chips and an upper portion of the plurality of LED chips by an inkjet method to form an LED protection layer. The curable composition for inkjet coating and LED protection according to the present invention comprises: a first polyfunctional (meth) acrylate compound having a plurality of (meth) acryloyl groups and an aliphatic cyclic skeleton; a second polyfunctional (meth) acrylate compound having a plurality of (meth) acryloyl groups and having an oxyalkylene skeleton; and a photopolymerization initiator. The viscosity of the curable composition at 25 DEG C is from 80 mPa.s to 2000 mPa.s (inclusive). 本发明提供通过喷墨法在多个LED芯片的间隙和多个LED芯片的上部中的至少一者处涂布固化性组合物以形成LED保护层时,能够良好地保持涂布物的边缘部分的形状的、用于喷墨涂布和LED保护的固化性组合物。本发明的用于喷墨涂布和LED保护的固化性组合物包含:具有多个(甲基)丙烯酰基
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CURABLE COMPOSITION FOR INKJET COATING AND LED PROTECTION, LED MODULE, METHOD FOR MANUFACTURING LED MODULE, AND LED DISPLAY DEVICE
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