Device installation device for integrated circuit processing

The invention discloses a device installation device for integrated circuit processing. The device installation device comprises a workbench, a back plate is fixed above the workbench, a smearing piece used for smearing solder paste is arranged on the back plate in a sliding mode, a driving piece us...

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Hauptverfasser: HU JINGWEN, CAI KEJUN, PENG YIMIN, ZHANG YINGNA, CAI RUNPING, ZHANG LI
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Sprache:chi ; eng
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creator HU JINGWEN
CAI KEJUN
PENG YIMIN
ZHANG YINGNA
CAI RUNPING
ZHANG LI
description The invention discloses a device installation device for integrated circuit processing. The device installation device comprises a workbench, a back plate is fixed above the workbench, a smearing piece used for smearing solder paste is arranged on the back plate in a sliding mode, a driving piece used for driving the smearing piece to slide is fixed to the back plate, and an installation piece used for device installation is arranged on the back plate in a sliding mode. According to the device mounting device, before the position of the horizontal plate is adjusted, a second rack is clamped on a first rack, and a fourth rack is clamped on a third rack, so that a third connecting plate is braked, a clamp is made to stay at the position close to the horizontal plate, and when the position of the horizontal plate is adjusted or in the solder paste smearing process, the device mounting device is convenient to operate. A fourth electric telescopic rod and a third air cylinder are started to adjust the fixed distan
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116017875A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116017875A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116017875A3</originalsourceid><addsrcrecordid>eNrjZLBxSS3LTE5VyMwrLknMyUksyczPU0iBiKXlFwHFS1LTixJLUlMUkjOLkkszSxQKivKTU4uLM_PSeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGZgaG5hbmpozExagAgcjBb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Device installation device for integrated circuit processing</title><source>esp@cenet</source><creator>HU JINGWEN ; CAI KEJUN ; PENG YIMIN ; ZHANG YINGNA ; CAI RUNPING ; ZHANG LI</creator><creatorcontrib>HU JINGWEN ; CAI KEJUN ; PENG YIMIN ; ZHANG YINGNA ; CAI RUNPING ; ZHANG LI</creatorcontrib><description>The invention discloses a device installation device for integrated circuit processing. The device installation device comprises a workbench, a back plate is fixed above the workbench, a smearing piece used for smearing solder paste is arranged on the back plate in a sliding mode, a driving piece used for driving the smearing piece to slide is fixed to the back plate, and an installation piece used for device installation is arranged on the back plate in a sliding mode. According to the device mounting device, before the position of the horizontal plate is adjusted, a second rack is clamped on a first rack, and a fourth rack is clamped on a third rack, so that a third connecting plate is braked, a clamp is made to stay at the position close to the horizontal plate, and when the position of the horizontal plate is adjusted or in the solder paste smearing process, the device mounting device is convenient to operate. A fourth electric telescopic rod and a third air cylinder are started to adjust the fixed distan</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230425&amp;DB=EPODOC&amp;CC=CN&amp;NR=116017875A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230425&amp;DB=EPODOC&amp;CC=CN&amp;NR=116017875A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU JINGWEN</creatorcontrib><creatorcontrib>CAI KEJUN</creatorcontrib><creatorcontrib>PENG YIMIN</creatorcontrib><creatorcontrib>ZHANG YINGNA</creatorcontrib><creatorcontrib>CAI RUNPING</creatorcontrib><creatorcontrib>ZHANG LI</creatorcontrib><title>Device installation device for integrated circuit processing</title><description>The invention discloses a device installation device for integrated circuit processing. The device installation device comprises a workbench, a back plate is fixed above the workbench, a smearing piece used for smearing solder paste is arranged on the back plate in a sliding mode, a driving piece used for driving the smearing piece to slide is fixed to the back plate, and an installation piece used for device installation is arranged on the back plate in a sliding mode. According to the device mounting device, before the position of the horizontal plate is adjusted, a second rack is clamped on a first rack, and a fourth rack is clamped on a third rack, so that a third connecting plate is braked, a clamp is made to stay at the position close to the horizontal plate, and when the position of the horizontal plate is adjusted or in the solder paste smearing process, the device mounting device is convenient to operate. A fourth electric telescopic rod and a third air cylinder are started to adjust the fixed distan</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxSS3LTE5VyMwrLknMyUksyczPU0iBiKXlFwHFS1LTixJLUlMUkjOLkkszSxQKivKTU4uLM_PSeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGZgaG5hbmpozExagAgcjBb</recordid><startdate>20230425</startdate><enddate>20230425</enddate><creator>HU JINGWEN</creator><creator>CAI KEJUN</creator><creator>PENG YIMIN</creator><creator>ZHANG YINGNA</creator><creator>CAI RUNPING</creator><creator>ZHANG LI</creator><scope>EVB</scope></search><sort><creationdate>20230425</creationdate><title>Device installation device for integrated circuit processing</title><author>HU JINGWEN ; CAI KEJUN ; PENG YIMIN ; ZHANG YINGNA ; CAI RUNPING ; ZHANG LI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116017875A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HU JINGWEN</creatorcontrib><creatorcontrib>CAI KEJUN</creatorcontrib><creatorcontrib>PENG YIMIN</creatorcontrib><creatorcontrib>ZHANG YINGNA</creatorcontrib><creatorcontrib>CAI RUNPING</creatorcontrib><creatorcontrib>ZHANG LI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU JINGWEN</au><au>CAI KEJUN</au><au>PENG YIMIN</au><au>ZHANG YINGNA</au><au>CAI RUNPING</au><au>ZHANG LI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Device installation device for integrated circuit processing</title><date>2023-04-25</date><risdate>2023</risdate><abstract>The invention discloses a device installation device for integrated circuit processing. The device installation device comprises a workbench, a back plate is fixed above the workbench, a smearing piece used for smearing solder paste is arranged on the back plate in a sliding mode, a driving piece used for driving the smearing piece to slide is fixed to the back plate, and an installation piece used for device installation is arranged on the back plate in a sliding mode. According to the device mounting device, before the position of the horizontal plate is adjusted, a second rack is clamped on a first rack, and a fourth rack is clamped on a third rack, so that a third connecting plate is braked, a clamp is made to stay at the position close to the horizontal plate, and when the position of the horizontal plate is adjusted or in the solder paste smearing process, the device mounting device is convenient to operate. A fourth electric telescopic rod and a third air cylinder are started to adjust the fixed distan</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Device installation device for integrated circuit processing
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