Method for preparing fine copper powder by recovering PCB alkaline etching waste liquid
The invention discloses a method for preparing fine copper powder by recovering PCB (printed circuit board) alkaline etching waste liquid, which comprises the following steps: under the condition of an ultrasonic field, adding a proper amount of sodium hydroxide into the PCB alkaline etching waste l...
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| creator | SU ANBANG ZHU QIANG YANG JIANGUANG |
| description | The invention discloses a method for preparing fine copper powder by recovering PCB (printed circuit board) alkaline etching waste liquid, which comprises the following steps: under the condition of an ultrasonic field, adding a proper amount of sodium hydroxide into the PCB alkaline etching waste liquid to adjust the pH value of the solution, adding a certain mass of glucose to carry out pre-reduction reaction, then adding PVP (polyvinylpyrrolidone) and thiourea dioxide to carry out reduction reaction, and finally preparing the fine copper powder. Cuprous oxide generated by the pre-reduction effect is reduced into elementary copper, and fine copper powder is obtained. According to the method, an ultrasonic-assisted two-step liquid phase reduction method is adopted, valuable metal copper is recycled from the PCB alkaline etching waste liquid, and resource recycling and recycling of the etching waste liquid are achieved. Compared with the prior art, the method has the advantages of simple process, short reacti |
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Cuprous oxide generated by the pre-reduction effect is reduced into elementary copper, and fine copper powder is obtained. According to the method, an ultrasonic-assisted two-step liquid phase reduction method is adopted, valuable metal copper is recycled from the PCB alkaline etching waste liquid, and resource recycling and recycling of the etching waste liquid are achieved. Compared with the prior art, the method has the advantages of simple process, short reacti</description><language>chi ; eng</language><subject>CASTING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; FERROUS OR NON-FERROUS ALLOYS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRETREATMENT OF RAW MATERIALS ; PRODUCTION AND REFINING OF METALS ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WORKING METALLIC POWDER</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230418&DB=EPODOC&CC=CN&NR=115976335A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230418&DB=EPODOC&CC=CN&NR=115976335A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SU ANBANG</creatorcontrib><creatorcontrib>ZHU QIANG</creatorcontrib><creatorcontrib>YANG JIANGUANG</creatorcontrib><title>Method for preparing fine copper powder by recovering PCB alkaline etching waste liquid</title><description>The invention discloses a method for preparing fine copper powder by recovering PCB (printed circuit board) alkaline etching waste liquid, which comprises the following steps: under the condition of an ultrasonic field, adding a proper amount of sodium hydroxide into the PCB alkaline etching waste liquid to adjust the pH value of the solution, adding a certain mass of glucose to carry out pre-reduction reaction, then adding PVP (polyvinylpyrrolidone) and thiourea dioxide to carry out reduction reaction, and finally preparing the fine copper powder. Cuprous oxide generated by the pre-reduction effect is reduced into elementary copper, and fine copper powder is obtained. According to the method, an ultrasonic-assisted two-step liquid phase reduction method is adopted, valuable metal copper is recycled from the PCB alkaline etching waste liquid, and resource recycling and recycling of the etching waste liquid are achieved. Compared with the prior art, the method has the advantages of simple process, short reacti</description><subject>CASTING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>PRETREATMENT OF RAW MATERIALS</subject><subject>PRODUCTION AND REFINING OF METALS</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj3TS3JyE9RSMsvUigoSi1ILMrMS1dIy8xLVUjOLyhIBYrml6cAqaRKhaLU5PyyVLCCAGcnhcSc7MQckMLUkuQMkGB5YnFJqkJOZmFpZgoPA2taYk5xKi-U5mZQdHMNcfbQTS3Ij08tLkhMTs1LLYl39jM0NLU0NzM2NnU0JkYNADcfOa0</recordid><startdate>20230418</startdate><enddate>20230418</enddate><creator>SU ANBANG</creator><creator>ZHU QIANG</creator><creator>YANG JIANGUANG</creator><scope>EVB</scope></search><sort><creationdate>20230418</creationdate><title>Method for preparing fine copper powder by recovering PCB alkaline etching waste liquid</title><author>SU ANBANG ; ZHU QIANG ; YANG JIANGUANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115976335A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASTING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>PRETREATMENT OF RAW MATERIALS</topic><topic>PRODUCTION AND REFINING OF METALS</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>SU ANBANG</creatorcontrib><creatorcontrib>ZHU QIANG</creatorcontrib><creatorcontrib>YANG JIANGUANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SU ANBANG</au><au>ZHU QIANG</au><au>YANG JIANGUANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for preparing fine copper powder by recovering PCB alkaline etching waste liquid</title><date>2023-04-18</date><risdate>2023</risdate><abstract>The invention discloses a method for preparing fine copper powder by recovering PCB (printed circuit board) alkaline etching waste liquid, which comprises the following steps: under the condition of an ultrasonic field, adding a proper amount of sodium hydroxide into the PCB alkaline etching waste liquid to adjust the pH value of the solution, adding a certain mass of glucose to carry out pre-reduction reaction, then adding PVP (polyvinylpyrrolidone) and thiourea dioxide to carry out reduction reaction, and finally preparing the fine copper powder. Cuprous oxide generated by the pre-reduction effect is reduced into elementary copper, and fine copper powder is obtained. According to the method, an ultrasonic-assisted two-step liquid phase reduction method is adopted, valuable metal copper is recycled from the PCB alkaline etching waste liquid, and resource recycling and recycling of the etching waste liquid are achieved. Compared with the prior art, the method has the advantages of simple process, short reacti</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS POWDER METALLURGY PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER |
| title | Method for preparing fine copper powder by recovering PCB alkaline etching waste liquid |
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