Conductive adhesive composition
According to the present invention, good adhesive strength can be achieved in a conductive adhesive composition containing a conductive powder and a curable component. The conductive adhesive composition is characterized in that the conductive adhesive composition contains (A) a conductive powder an...
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| creator | OCHIAI NOBUO TOMEKAWA SATORU KASUGAI TAKAYUKI ARAI TAKAMITSU |
| description | According to the present invention, good adhesive strength can be achieved in a conductive adhesive composition containing a conductive powder and a curable component. The conductive adhesive composition is characterized in that the conductive adhesive composition contains (A) a conductive powder and (B) a curable component, the content of the (B) curable component is 20 parts by mass or more when the conductive powder (A) is taken as 100 parts by mass, and the conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having a general formula (1) or (2), and the content of the curable component (B) is 20 parts by mass or more when the conductive powder (A) is taken as 100 parts by mass. And the molecular weight is in the range of 150 to 1000. In the formula (1) or (2), X represents a hydrogen atom (H) or a methyl group (CH3). When the total amount of the conductive powder (A) and the curable component (B) is taken as 100 parts by mass, the content of the curable compo |
| format | Patent |
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The conductive adhesive composition is characterized in that the conductive adhesive composition contains (A) a conductive powder and (B) a curable component, the content of the (B) curable component is 20 parts by mass or more when the conductive powder (A) is taken as 100 parts by mass, and the conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having a general formula (1) or (2), and the content of the curable component (B) is 20 parts by mass or more when the conductive powder (A) is taken as 100 parts by mass. And the molecular weight is in the range of 150 to 1000. In the formula (1) or (2), X represents a hydrogen atom (H) or a methyl group (CH3). 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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Conductive adhesive composition |
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