Polyimide modified epoxy resin and application thereof

The invention discloses polyimide modified epoxy resin and application thereof, raw materials of the polyimide modified epoxy resin comprise polyimide and epoxy resin, the polyimide is double-terminated polyimide with a softening point less than or equal to 70 DEG C and a molecular weight of 1000-50...

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Bibliographische Detailangaben
Hauptverfasser:	GU JIANFENG, ZHANG CHUNQI, WU BIN, ZHOU LIANG, MA JUNFENG, JING LURU, JING FENGXI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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