Manufacturing method and manufacturing equipment for bonding pad on circuit board
The invention belongs to the technical field of printed circuit boards, and provides a method and equipment for manufacturing a bonding pad on a circuit board, and the method comprises the steps: creating a vacuum environment in an etching process, and carrying out the etching of an outer layer subs...
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| creator | GUO XIAOHUA LI HUA PENG LANGXIANG |
| description | The invention belongs to the technical field of printed circuit boards, and provides a method and equipment for manufacturing a bonding pad on a circuit board, and the method comprises the steps: creating a vacuum environment in an etching process, and carrying out the etching of an outer layer substrate of the circuit board through an etching line, so as to obtain the size of an outer layer bonding pad; in the solder resist developing process, developing liquid medicine is controlled to be sprayed to the board surface of the outer layer substrate of the circuit board in an oval shape by controlling an opening of a spray nozzle, and the distance between the opening of the spray nozzle and the board surface of the outer layer substrate of the circuit board in the developing process is controlled to be 90-110 mm; by controlling vacuum etching, the finished value and the design value of the size of the outer-layer bonding pad are closer to be accurate, the manufacturing capacity of the resistance welding bridge |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115884529A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115884529A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115884529A3</originalsourceid><addsrcrecordid>eNrjZAj0TcwrTUtMLiktysxLV8hNLcnIT1FIzEtRyEWRSC0szSzITc0rUUjLL1JIys9LAYkWJKYo5OcpJGcWJZdmlgCFE4tSeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGphYWJqZGlozExagAT3zgX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method and manufacturing equipment for bonding pad on circuit board</title><source>esp@cenet</source><creator>GUO XIAOHUA ; LI HUA ; PENG LANGXIANG</creator><creatorcontrib>GUO XIAOHUA ; LI HUA ; PENG LANGXIANG</creatorcontrib><description>The invention belongs to the technical field of printed circuit boards, and provides a method and equipment for manufacturing a bonding pad on a circuit board, and the method comprises the steps: creating a vacuum environment in an etching process, and carrying out the etching of an outer layer substrate of the circuit board through an etching line, so as to obtain the size of an outer layer bonding pad; in the solder resist developing process, developing liquid medicine is controlled to be sprayed to the board surface of the outer layer substrate of the circuit board in an oval shape by controlling an opening of a spray nozzle, and the distance between the opening of the spray nozzle and the board surface of the outer layer substrate of the circuit board in the developing process is controlled to be 90-110 mm; by controlling vacuum etching, the finished value and the design value of the size of the outer-layer bonding pad are closer to be accurate, the manufacturing capacity of the resistance welding bridge</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230331&DB=EPODOC&CC=CN&NR=115884529A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230331&DB=EPODOC&CC=CN&NR=115884529A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO XIAOHUA</creatorcontrib><creatorcontrib>LI HUA</creatorcontrib><creatorcontrib>PENG LANGXIANG</creatorcontrib><title>Manufacturing method and manufacturing equipment for bonding pad on circuit board</title><description>The invention belongs to the technical field of printed circuit boards, and provides a method and equipment for manufacturing a bonding pad on a circuit board, and the method comprises the steps: creating a vacuum environment in an etching process, and carrying out the etching of an outer layer substrate of the circuit board through an etching line, so as to obtain the size of an outer layer bonding pad; in the solder resist developing process, developing liquid medicine is controlled to be sprayed to the board surface of the outer layer substrate of the circuit board in an oval shape by controlling an opening of a spray nozzle, and the distance between the opening of the spray nozzle and the board surface of the outer layer substrate of the circuit board in the developing process is controlled to be 90-110 mm; by controlling vacuum etching, the finished value and the design value of the size of the outer-layer bonding pad are closer to be accurate, the manufacturing capacity of the resistance welding bridge</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj0TcwrTUtMLiktysxLV8hNLcnIT1FIzEtRyEWRSC0szSzITc0rUUjLL1JIys9LAYkWJKYo5OcpJGcWJZdmlgCFE4tSeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGphYWJqZGlozExagAT3zgX</recordid><startdate>20230331</startdate><enddate>20230331</enddate><creator>GUO XIAOHUA</creator><creator>LI HUA</creator><creator>PENG LANGXIANG</creator><scope>EVB</scope></search><sort><creationdate>20230331</creationdate><title>Manufacturing method and manufacturing equipment for bonding pad on circuit board</title><author>GUO XIAOHUA ; LI HUA ; PENG LANGXIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115884529A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO XIAOHUA</creatorcontrib><creatorcontrib>LI HUA</creatorcontrib><creatorcontrib>PENG LANGXIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO XIAOHUA</au><au>LI HUA</au><au>PENG LANGXIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method and manufacturing equipment for bonding pad on circuit board</title><date>2023-03-31</date><risdate>2023</risdate><abstract>The invention belongs to the technical field of printed circuit boards, and provides a method and equipment for manufacturing a bonding pad on a circuit board, and the method comprises the steps: creating a vacuum environment in an etching process, and carrying out the etching of an outer layer substrate of the circuit board through an etching line, so as to obtain the size of an outer layer bonding pad; in the solder resist developing process, developing liquid medicine is controlled to be sprayed to the board surface of the outer layer substrate of the circuit board in an oval shape by controlling an opening of a spray nozzle, and the distance between the opening of the spray nozzle and the board surface of the outer layer substrate of the circuit board in the developing process is controlled to be 90-110 mm; by controlling vacuum etching, the finished value and the design value of the size of the outer-layer bonding pad are closer to be accurate, the manufacturing capacity of the resistance welding bridge</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Manufacturing method and manufacturing equipment for bonding pad on circuit board |
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