Isolator and chip
The embodiment of the invention provides an isolator and a chip. A first binding pad of a first substrate is electrically connected with a first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of a first insulating substrate; a second binding pa...
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| creator | LIU SHUIHUA |
| description | The embodiment of the invention provides an isolator and a chip. A first binding pad of a first substrate is electrically connected with a first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of a first insulating substrate; a second binding pad of the second substrate is electrically connected with the second conductive coil, and the second binding pad and the second conductive coil are arranged on the same side of the second insulating substrate; wherein the first conductive coil is arranged on the side, away from the second insulating substrate, of the first insulating substrate, and the second conductive coil is arranged on the side, facing the first insulating substrate, of the second insulating substrate; at least part of the second binding pad is not overlapped with the first substrate in the thickness direction of the isolator. According to the isolator, the insulating substrate is adopted as the substrate, the preparation efficiency is high, the |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115831916A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115831916A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115831916A3</originalsourceid><addsrcrecordid>eNrjZBD0LM7PSSzJL1JIzEtRSM7ILOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGphbGhpaGZo7GxKgBALuOH2I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Isolator and chip</title><source>esp@cenet</source><creator>LIU SHUIHUA</creator><creatorcontrib>LIU SHUIHUA</creatorcontrib><description>The embodiment of the invention provides an isolator and a chip. A first binding pad of a first substrate is electrically connected with a first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of a first insulating substrate; a second binding pad of the second substrate is electrically connected with the second conductive coil, and the second binding pad and the second conductive coil are arranged on the same side of the second insulating substrate; wherein the first conductive coil is arranged on the side, away from the second insulating substrate, of the first insulating substrate, and the second conductive coil is arranged on the side, facing the first insulating substrate, of the second insulating substrate; at least part of the second binding pad is not overlapped with the first substrate in the thickness direction of the isolator. According to the isolator, the insulating substrate is adopted as the substrate, the preparation efficiency is high, the</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230321&DB=EPODOC&CC=CN&NR=115831916A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230321&DB=EPODOC&CC=CN&NR=115831916A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU SHUIHUA</creatorcontrib><title>Isolator and chip</title><description>The embodiment of the invention provides an isolator and a chip. A first binding pad of a first substrate is electrically connected with a first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of a first insulating substrate; a second binding pad of the second substrate is electrically connected with the second conductive coil, and the second binding pad and the second conductive coil are arranged on the same side of the second insulating substrate; wherein the first conductive coil is arranged on the side, away from the second insulating substrate, of the first insulating substrate, and the second conductive coil is arranged on the side, facing the first insulating substrate, of the second insulating substrate; at least part of the second binding pad is not overlapped with the first substrate in the thickness direction of the isolator. According to the isolator, the insulating substrate is adopted as the substrate, the preparation efficiency is high, the</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD0LM7PSSzJL1JIzEtRSM7ILOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGphbGhpaGZo7GxKgBALuOH2I</recordid><startdate>20230321</startdate><enddate>20230321</enddate><creator>LIU SHUIHUA</creator><scope>EVB</scope></search><sort><creationdate>20230321</creationdate><title>Isolator and chip</title><author>LIU SHUIHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115831916A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU SHUIHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU SHUIHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Isolator and chip</title><date>2023-03-21</date><risdate>2023</risdate><abstract>The embodiment of the invention provides an isolator and a chip. A first binding pad of a first substrate is electrically connected with a first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of a first insulating substrate; a second binding pad of the second substrate is electrically connected with the second conductive coil, and the second binding pad and the second conductive coil are arranged on the same side of the second insulating substrate; wherein the first conductive coil is arranged on the side, away from the second insulating substrate, of the first insulating substrate, and the second conductive coil is arranged on the side, facing the first insulating substrate, of the second insulating substrate; at least part of the second binding pad is not overlapped with the first substrate in the thickness direction of the isolator. According to the isolator, the insulating substrate is adopted as the substrate, the preparation efficiency is high, the</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Isolator and chip |
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