Silicone-based adhesive and adhesive tape
The provided adhesive is a silicone adhesive having an initial adhesive force of 0.2-3 N/20 mm and an adhesive force of 4 N/20 mm or less after heating at 260 DEG C for 30 minutes. The adhesive tape is provided with a cured layer of the silicone adhesive. The adhesive tape further comprises a base m...
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| creator | SHIMIZU IZUMI WATANABE YOSHINORI |
| description | The provided adhesive is a silicone adhesive having an initial adhesive force of 0.2-3 N/20 mm and an adhesive force of 4 N/20 mm or less after heating at 260 DEG C for 30 minutes. The adhesive tape is provided with a cured layer of the silicone adhesive. The adhesive tape further comprises a base material, and the cured layer may be provided on the surface of the base material. The adhesive tape has excellent adhesion performance and can realize low thermal dependence. The pressure-sensitive adhesive can realize the pressure-sensitive adhesive tape.
所提供的粘合剂是初始粘合力为0.2～3N/20mm、260℃和30分钟的加热后的粘合力为4N/20mm以下的有机硅系粘合剂。所提供的粘合带具备上述有机硅系粘合剂的固化层。粘合带还具备基材，固化层可以设置于基材的表面。上述粘合带的粘贴性能优异，且能够实现低的热依赖性。上述粘合剂能够实现上述粘合带。 |
| format | Patent |
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所提供的粘合剂是初始粘合力为0.2～3N/20mm、260℃和30分钟的加热后的粘合力为4N/20mm以下的有机硅系粘合剂。所提供的粘合带具备上述有机硅系粘合剂的固化层。粘合带还具备基材，固化层可以设置于基材的表面。上述粘合带的粘贴性能优异，且能够实现低的热依赖性。上述粘合剂能够实现上述粘合带。</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230314&DB=EPODOC&CC=CN&NR=115803414A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230314&DB=EPODOC&CC=CN&NR=115803414A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMIZU IZUMI</creatorcontrib><creatorcontrib>WATANABE YOSHINORI</creatorcontrib><title>Silicone-based adhesive and adhesive tape</title><description>The provided adhesive is a silicone adhesive having an initial adhesive force of 0.2-3 N/20 mm and an adhesive force of 4 N/20 mm or less after heating at 260 DEG C for 30 minutes. The adhesive tape is provided with a cured layer of the silicone adhesive. The adhesive tape further comprises a base material, and the cured layer may be provided on the surface of the base material. The adhesive tape has excellent adhesion performance and can realize low thermal dependence. The pressure-sensitive adhesive can realize the pressure-sensitive adhesive tape.
所提供的粘合剂是初始粘合力为0.2～3N/20mm、260℃和30分钟的加热后的粘合力为4N/20mm以下的有机硅系粘合剂。所提供的粘合带具备上述有机硅系粘合剂的固化层。粘合带还具备基材，固化层可以设置于基材的表面。上述粘合带的粘贴性能优异，且能够实现低的热依赖性。上述粘合剂能够实现上述粘合带。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMzszJTM7PS9VNSixOTVFITMlILc4sS1VIzEPilCQWpPIwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDUwsDYxNDE0djYtQAAOIbKFc</recordid><startdate>20230314</startdate><enddate>20230314</enddate><creator>SHIMIZU IZUMI</creator><creator>WATANABE YOSHINORI</creator><scope>EVB</scope></search><sort><creationdate>20230314</creationdate><title>Silicone-based adhesive and adhesive tape</title><author>SHIMIZU IZUMI ; WATANABE YOSHINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115803414A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMIZU IZUMI</creatorcontrib><creatorcontrib>WATANABE YOSHINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMIZU IZUMI</au><au>WATANABE YOSHINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicone-based adhesive and adhesive tape</title><date>2023-03-14</date><risdate>2023</risdate><abstract>The provided adhesive is a silicone adhesive having an initial adhesive force of 0.2-3 N/20 mm and an adhesive force of 4 N/20 mm or less after heating at 260 DEG C for 30 minutes. The adhesive tape is provided with a cured layer of the silicone adhesive. The adhesive tape further comprises a base material, and the cured layer may be provided on the surface of the base material. The adhesive tape has excellent adhesion performance and can realize low thermal dependence. The pressure-sensitive adhesive can realize the pressure-sensitive adhesive tape.
所提供的粘合剂是初始粘合力为0.2～3N/20mm、260℃和30分钟的加热后的粘合力为4N/20mm以下的有机硅系粘合剂。所提供的粘合带具备上述有机硅系粘合剂的固化层。粘合带还具备基材，固化层可以设置于基材的表面。上述粘合带的粘贴性能优异，且能够实现低的热依赖性。上述粘合剂能够实现上述粘合带。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Silicone-based adhesive and adhesive tape |
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