Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board
The purpose of the present invention is to provide a conductive paste capable of improving the bonding strength with an electronic component without using a separate adhesive. A conductive paste containing an organic component and conductive particles, in which the storage modulus G '(P100) at...
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| creator | TAJIMA IZUMI MIZUGUCHI TSUKURU ITSUKI NAOHIDE |
| description | The purpose of the present invention is to provide a conductive paste capable of improving the bonding strength with an electronic component without using a separate adhesive. A conductive paste containing an organic component and conductive particles, in which the storage modulus G '(P100) at 100 DEG C of a dry film of the conductive paste is 0.01 MPa or less, and the storage modulus G' (C25) at 25 DEG C after heating at 140 DEG C for 30 minutes is 0.01 MPa or more.
本发明的目的在于提供即使不另外使用粘接剂也能够提高与电子部件的接合强度的导电糊剂。导电糊剂，其含有有机成分及导电性粒子，前述导电糊剂的干燥膜的100℃时的储能模量G'(P100)为0.01MPa以下，于140℃加热30分钟后的25℃时的储能模量G'(C25)为0.01MPa以上。 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115769145A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115769145A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115769145A3</originalsourceid><addsrcrecordid>eNrjZOhwzs9LKU0uySxLVShILC5J1VEoKMrMK0lNUSjPBDLSFZLyE4tSdBRyU0sy8lMU0vKLFHIT80rTEpNLSsHy2JUn5qWQpoWHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkampqbWRqamDoaE6MGAAKoTKc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board</title><source>esp@cenet</source><creator>TAJIMA IZUMI ; MIZUGUCHI TSUKURU ; ITSUKI NAOHIDE</creator><creatorcontrib>TAJIMA IZUMI ; MIZUGUCHI TSUKURU ; ITSUKI NAOHIDE</creatorcontrib><description>The purpose of the present invention is to provide a conductive paste capable of improving the bonding strength with an electronic component without using a separate adhesive. A conductive paste containing an organic component and conductive particles, in which the storage modulus G '(P100) at 100 DEG C of a dry film of the conductive paste is 0.01 MPa or less, and the storage modulus G' (C25) at 25 DEG C after heating at 140 DEG C for 30 minutes is 0.01 MPa or more.
本发明的目的在于提供即使不另外使用粘接剂也能够提高与电子部件的接合强度的导电糊剂。导电糊剂，其含有有机成分及导电性粒子，前述导电糊剂的干燥膜的100℃时的储能模量G'(P100)为0.01MPa以下，于140℃加热30分钟后的25℃时的储能模量G'(C25)为0.01MPa以上。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230307&DB=EPODOC&CC=CN&NR=115769145A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230307&DB=EPODOC&CC=CN&NR=115769145A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAJIMA IZUMI</creatorcontrib><creatorcontrib>MIZUGUCHI TSUKURU</creatorcontrib><creatorcontrib>ITSUKI NAOHIDE</creatorcontrib><title>Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board</title><description>The purpose of the present invention is to provide a conductive paste capable of improving the bonding strength with an electronic component without using a separate adhesive. A conductive paste containing an organic component and conductive particles, in which the storage modulus G '(P100) at 100 DEG C of a dry film of the conductive paste is 0.01 MPa or less, and the storage modulus G' (C25) at 25 DEG C after heating at 140 DEG C for 30 minutes is 0.01 MPa or more.
本发明的目的在于提供即使不另外使用粘接剂也能够提高与电子部件的接合强度的导电糊剂。导电糊剂，其含有有机成分及导电性粒子，前述导电糊剂的干燥膜的100℃时的储能模量G'(P100)为0.01MPa以下，于140℃加热30分钟后的25℃时的储能模量G'(C25)为0.01MPa以上。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOhwzs9LKU0uySxLVShILC5J1VEoKMrMK0lNUSjPBDLSFZLyE4tSdBRyU0sy8lMU0vKLFHIT80rTEpNLSsHy2JUn5qWQpoWHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkampqbWRqamDoaE6MGAAKoTKc</recordid><startdate>20230307</startdate><enddate>20230307</enddate><creator>TAJIMA IZUMI</creator><creator>MIZUGUCHI TSUKURU</creator><creator>ITSUKI NAOHIDE</creator><scope>EVB</scope></search><sort><creationdate>20230307</creationdate><title>Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board</title><author>TAJIMA IZUMI ; MIZUGUCHI TSUKURU ; ITSUKI NAOHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115769145A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAJIMA IZUMI</creatorcontrib><creatorcontrib>MIZUGUCHI TSUKURU</creatorcontrib><creatorcontrib>ITSUKI NAOHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAJIMA IZUMI</au><au>MIZUGUCHI TSUKURU</au><au>ITSUKI NAOHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board</title><date>2023-03-07</date><risdate>2023</risdate><abstract>The purpose of the present invention is to provide a conductive paste capable of improving the bonding strength with an electronic component without using a separate adhesive. A conductive paste containing an organic component and conductive particles, in which the storage modulus G '(P100) at 100 DEG C of a dry film of the conductive paste is 0.01 MPa or less, and the storage modulus G' (C25) at 25 DEG C after heating at 140 DEG C for 30 minutes is 0.01 MPa or more.
本发明的目的在于提供即使不另外使用粘接剂也能够提高与电子部件的接合强度的导电糊剂。导电糊剂，其含有有机成分及导电性粒子，前述导电糊剂的干燥膜的100℃时的储能模量G'(P100)为0.01MPa以下，于140℃加热30分钟后的25℃时的储能模量G'(C25)为0.01MPa以上。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board |
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