Purification treatment device for circuit board etching waste liquid
The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipatio...
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creator | WU RENZHI LIU SHOUJIAN JIN JIAN'AN |
description | The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to |
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The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to</description><language>chi ; eng</language><subject>CHEMISTRY ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; PRETREATMENT OF RAW MATERIALS ; PRODUCTION AND REFINING OF METALS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230307&DB=EPODOC&CC=CN&NR=115747498A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230307&DB=EPODOC&CC=CN&NR=115747498A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU RENZHI</creatorcontrib><creatorcontrib>LIU SHOUJIAN</creatorcontrib><creatorcontrib>JIN JIAN'AN</creatorcontrib><title>Purification treatment device for circuit board etching waste liquid</title><description>The invention discloses a purification treatment device for waste etching liquid of a circuit board. 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The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | CHEMISTRY FERROUS OR NON-FERROUS ALLOYS METALLURGY PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS TREATMENT OF ALLOYS OR NON-FERROUS METALS |
title | Purification treatment device for circuit board etching waste liquid |
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