Purification treatment device for circuit board etching waste liquid

The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipatio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WU RENZHI, LIU SHOUJIAN, JIN JIAN'AN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WU RENZHI
LIU SHOUJIAN
JIN JIAN'AN
description The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115747498A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115747498A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115747498A3</originalsourceid><addsrcrecordid>eNqNyjEOwjAMAMAsDAj4g3kAQ0VRYUQFxIQY2CvjOMVSSYrjwPdZeADTLTd1h2tRCUJokiKYMtqTo4HntxBDSAokSkUM7gnVAxs9JPbwwWwMg7yK-LmbBBwyL37O3PJ0vLXnFY-p4zwicWTr2ktVbZq6qXfb_fqf8wXtzDNI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Purification treatment device for circuit board etching waste liquid</title><source>esp@cenet</source><creator>WU RENZHI ; LIU SHOUJIAN ; JIN JIAN'AN</creator><creatorcontrib>WU RENZHI ; LIU SHOUJIAN ; JIN JIAN'AN</creatorcontrib><description>The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to</description><language>chi ; eng</language><subject>CHEMISTRY ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; PRETREATMENT OF RAW MATERIALS ; PRODUCTION AND REFINING OF METALS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230307&amp;DB=EPODOC&amp;CC=CN&amp;NR=115747498A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230307&amp;DB=EPODOC&amp;CC=CN&amp;NR=115747498A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU RENZHI</creatorcontrib><creatorcontrib>LIU SHOUJIAN</creatorcontrib><creatorcontrib>JIN JIAN'AN</creatorcontrib><title>Purification treatment device for circuit board etching waste liquid</title><description>The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to</description><subject>CHEMISTRY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>METALLURGY</subject><subject>PRETREATMENT OF RAW MATERIALS</subject><subject>PRODUCTION AND REFINING OF METALS</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEOwjAMAMAsDAj4g3kAQ0VRYUQFxIQY2CvjOMVSSYrjwPdZeADTLTd1h2tRCUJokiKYMtqTo4HntxBDSAokSkUM7gnVAxs9JPbwwWwMg7yK-LmbBBwyL37O3PJ0vLXnFY-p4zwicWTr2ktVbZq6qXfb_fqf8wXtzDNI</recordid><startdate>20230307</startdate><enddate>20230307</enddate><creator>WU RENZHI</creator><creator>LIU SHOUJIAN</creator><creator>JIN JIAN'AN</creator><scope>EVB</scope></search><sort><creationdate>20230307</creationdate><title>Purification treatment device for circuit board etching waste liquid</title><author>WU RENZHI ; LIU SHOUJIAN ; JIN JIAN'AN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115747498A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CHEMISTRY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>METALLURGY</topic><topic>PRETREATMENT OF RAW MATERIALS</topic><topic>PRODUCTION AND REFINING OF METALS</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>WU RENZHI</creatorcontrib><creatorcontrib>LIU SHOUJIAN</creatorcontrib><creatorcontrib>JIN JIAN'AN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU RENZHI</au><au>LIU SHOUJIAN</au><au>JIN JIAN'AN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Purification treatment device for circuit board etching waste liquid</title><date>2023-03-07</date><risdate>2023</risdate><abstract>The invention discloses a purification treatment device for waste etching liquid of a circuit board. The purification treatment device is characterized by comprising a water inlet pipe, a solar heating part, an intermittent pressurizing part, a water spraying and air sucking cover, a heat dissipation seat and a recovery device, the etching waste liquid is directly discharged into the water inlet pipe after being filtered; the water inlet pipe is communicated with an inlet of the solar heating component; waste etching liquid is preheated by the solar heating component and then enters the intermittent pressurizing component; the intermittent pressurizing part pressurizes the etching waste liquid and inputs the etching waste liquid into the water spraying and air sucking cover at set intervals; the water spraying and air suction cover covers the heat dissipation base, the surface temperature of the heat dissipation base is 200-300 DEG C, and the water spraying and air suction cover sprays etching waste liquid to</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN115747498A
source esp@cenet
subjects CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
PRETREATMENT OF RAW MATERIALS
PRODUCTION AND REFINING OF METALS
TREATMENT OF ALLOYS OR NON-FERROUS METALS
title Purification treatment device for circuit board etching waste liquid
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T11%3A15%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WU%20RENZHI&rft.date=2023-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115747498A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true