Regenerative semiconductor wafer laser cutting device

The invention relates to the field of wafer production equipment, in particular to a regenerative semiconductor wafer laser cutting device which comprises an operation cabinet, a workbench, a running track, a material conveying assembly, a cutting assembly and a containing groove. A control system is arranged at the front end of the operation cabinet; a working cavity is transversely formed in the middle of the operation cabinet; the workbench is arranged at the bottom of the working cavity, and supporting columns are fixedly arranged on the two sides of the workbench. The running track comprises a first transverse track and a second transverse track which are oppositely laid at the upper ends of the supporting columns and fixedly connected with the supporting columns; the material conveying assembly is fixedly installed on the operation track, is in sliding fit with the operation track and is electrically connected with the control system. The cutting assembly is fixedly installed on the top of the working c