Grinding device
When a polishing liquid supply head having a plurality of polishing liquid supply ports is moved on a polishing pad and polishing liquid is supplied, the uniformity of the supply range of the polishing liquid is improved. This polishing device (1) is provided with: a polishing table for supporting a...
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| creator | TERADA TETSUYA MORIURA TAKUYA SOTOZAKI HIROSHI |
| description | When a polishing liquid supply head having a plurality of polishing liquid supply ports is moved on a polishing pad and polishing liquid is supplied, the uniformity of the supply range of the polishing liquid is improved. This polishing device (1) is provided with: a polishing table for supporting a polishing pad (100); a polishing head (30) for holding an object; and a polishing liquid supply device (40) for supplying a polishing liquid between the polishing pad (100) and the object. The polishing liquid supply device (40) includes: a polishing liquid supply head (41) having a plurality of polishing liquid supply ports (414); a link mechanism (60) configured to move the polishing liquid supply head (41) along the polishing surface of the polishing pad (100); and a drive mechanism (90) configured to drive the link mechanism (60). The drive mechanism (90) is configured such that, in a first state (450) in which the polishing liquid supply head (41) is disposed facing the center side of the polishing pad (100), |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115734841A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115734841A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115734841A3</originalsourceid><addsrcrecordid>eNrjZOB3L8rMS8nMS1dISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqbmxiYWJoaOxsSoAQB2VR68</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Grinding device</title><source>esp@cenet</source><creator>TERADA TETSUYA ; MORIURA TAKUYA ; SOTOZAKI HIROSHI</creator><creatorcontrib>TERADA TETSUYA ; MORIURA TAKUYA ; SOTOZAKI HIROSHI</creatorcontrib><description>When a polishing liquid supply head having a plurality of polishing liquid supply ports is moved on a polishing pad and polishing liquid is supplied, the uniformity of the supply range of the polishing liquid is improved. This polishing device (1) is provided with: a polishing table for supporting a polishing pad (100); a polishing head (30) for holding an object; and a polishing liquid supply device (40) for supplying a polishing liquid between the polishing pad (100) and the object. The polishing liquid supply device (40) includes: a polishing liquid supply head (41) having a plurality of polishing liquid supply ports (414); a link mechanism (60) configured to move the polishing liquid supply head (41) along the polishing surface of the polishing pad (100); and a drive mechanism (90) configured to drive the link mechanism (60). The drive mechanism (90) is configured such that, in a first state (450) in which the polishing liquid supply head (41) is disposed facing the center side of the polishing pad (100),</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230303&DB=EPODOC&CC=CN&NR=115734841A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230303&DB=EPODOC&CC=CN&NR=115734841A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TERADA TETSUYA</creatorcontrib><creatorcontrib>MORIURA TAKUYA</creatorcontrib><creatorcontrib>SOTOZAKI HIROSHI</creatorcontrib><title>Grinding device</title><description>When a polishing liquid supply head having a plurality of polishing liquid supply ports is moved on a polishing pad and polishing liquid is supplied, the uniformity of the supply range of the polishing liquid is improved. This polishing device (1) is provided with: a polishing table for supporting a polishing pad (100); a polishing head (30) for holding an object; and a polishing liquid supply device (40) for supplying a polishing liquid between the polishing pad (100) and the object. The polishing liquid supply device (40) includes: a polishing liquid supply head (41) having a plurality of polishing liquid supply ports (414); a link mechanism (60) configured to move the polishing liquid supply head (41) along the polishing surface of the polishing pad (100); and a drive mechanism (90) configured to drive the link mechanism (60). The drive mechanism (90) is configured such that, in a first state (450) in which the polishing liquid supply head (41) is disposed facing the center side of the polishing pad (100),</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB3L8rMS8nMS1dISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqbmxiYWJoaOxsSoAQB2VR68</recordid><startdate>20230303</startdate><enddate>20230303</enddate><creator>TERADA TETSUYA</creator><creator>MORIURA TAKUYA</creator><creator>SOTOZAKI HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20230303</creationdate><title>Grinding device</title><author>TERADA TETSUYA ; MORIURA TAKUYA ; SOTOZAKI HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115734841A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TERADA TETSUYA</creatorcontrib><creatorcontrib>MORIURA TAKUYA</creatorcontrib><creatorcontrib>SOTOZAKI HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TERADA TETSUYA</au><au>MORIURA TAKUYA</au><au>SOTOZAKI HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding device</title><date>2023-03-03</date><risdate>2023</risdate><abstract>When a polishing liquid supply head having a plurality of polishing liquid supply ports is moved on a polishing pad and polishing liquid is supplied, the uniformity of the supply range of the polishing liquid is improved. This polishing device (1) is provided with: a polishing table for supporting a polishing pad (100); a polishing head (30) for holding an object; and a polishing liquid supply device (40) for supplying a polishing liquid between the polishing pad (100) and the object. The polishing liquid supply device (40) includes: a polishing liquid supply head (41) having a plurality of polishing liquid supply ports (414); a link mechanism (60) configured to move the polishing liquid supply head (41) along the polishing surface of the polishing pad (100); and a drive mechanism (90) configured to drive the link mechanism (60). The drive mechanism (90) is configured such that, in a first state (450) in which the polishing liquid supply head (41) is disposed facing the center side of the polishing pad (100),</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN115734841A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Grinding device |
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