RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

The resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and/or an alkylene group having 6 or more carbon atoms. The phosphorus-containing...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE RIHOKO, INOUE HIROHARU, WASHIO TEPPEI, YASUMOTO JUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and/or an alkylene group having 6 or more carbon atoms. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure represented by formula (b1). [In formula (b1): s represents an integer of 1-10; z represents an arylene group or an ester bond represented by formula (b1.1); r1 to R3 independently represent a hydrogen atom or a monovalent organic group; and each * represents a bond. ] 树脂组合物包含马来酰亚胺化合物(A)和含磷化合物(B)。马来酰亚胺化合物(A)包含具有碳原子为6个以上的烷基和/或碳原子为6个以上的亚烷基的第一马来酰亚胺化合物(A1)。含磷化合物(B)包含具有由式(b1)表示的结构的含磷化合物(B1)。[在式(b1)中：s表示1-10的整数；Z表示亚芳基或由式(b1.1)表示的酯键；R1至R3独立地表示氢原子或一价有机基团；并且各*表示键合。]