Resin composition, molded article, electromagnetic wave absorber, and method for measuring absorptivity of resin composition
Provided are: a resin composition which has a high electromagnetic wave absorption rate and low electromagnetic wave transmittance and reflectance, and which has a small difference in reflectance due to a difference in frequency of electromagnetic waves; also provided are a molded body and an electr...
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| creator | SHOUJI HIDEKAZU ISEKI SHUTA |
| description | Provided are: a resin composition which has a high electromagnetic wave absorption rate and low electromagnetic wave transmittance and reflectance, and which has a small difference in reflectance due to a difference in frequency of electromagnetic waves; also provided are a molded body and an electromagnetic wave absorber. The resin composition contains 0.1-10.0 parts by mass of carbon nanotubes and 10-100 parts by mass of glass fibers per 100 parts by mass of a thermoplastic resin, and the mass ratio of the carbon nanotubes to the glass fibers (carbon nanotubes/glass fibers) is 0.01-0.30.
提供一种树脂组合物，其是电磁波的吸收率高且电磁波的透射率和反射率低的树脂组合物，其中，电磁波的频率差异导致的反射率之差小；并且提供成型体和电磁波吸收体。一种树脂组合物，相对于热塑性树脂100质量份，包含碳纳米管0.1～10.0质量份和玻璃纤维10～100质量份，碳纳米管与玻璃纤维的质量比例(碳纳米管/玻璃纤维)为0.01～0.30。 |
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提供一种树脂组合物，其是电磁波的吸收率高且电磁波的透射率和反射率低的树脂组合物，其中，电磁波的频率差异导致的反射率之差小；并且提供成型体和电磁波吸收体。一种树脂组合物，相对于热塑性树脂100质量份，包含碳纳米管0.1～10.0质量份和玻璃纤维10～100质量份，碳纳米管与玻璃纤维的质量比例(碳纳米管/玻璃纤维)为0.01～0.30。</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230203&DB=EPODOC&CC=CN&NR=115698185A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230203&DB=EPODOC&CC=CN&NR=115698185A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHOUJI HIDEKAZU</creatorcontrib><creatorcontrib>ISEKI SHUTA</creatorcontrib><title>Resin composition, molded article, electromagnetic wave absorber, and method for measuring absorptivity of resin composition</title><description>Provided are: a resin composition which has a high electromagnetic wave absorption rate and low electromagnetic wave transmittance and reflectance, and which has a small difference in reflectance due to a difference in frequency of electromagnetic waves; also provided are a molded body and an electromagnetic wave absorber. The resin composition contains 0.1-10.0 parts by mass of carbon nanotubes and 10-100 parts by mass of glass fibers per 100 parts by mass of a thermoplastic resin, and the mass ratio of the carbon nanotubes to the glass fibers (carbon nanotubes/glass fibers) is 0.01-0.30.
提供一种树脂组合物，其是电磁波的吸收率高且电磁波的透射率和反射率低的树脂组合物，其中，电磁波的频率差异导致的反射率之差小；并且提供成型体和电磁波吸收体。一种树脂组合物，相对于热塑性树脂100质量份，包含碳纳米管0.1～10.0质量份和玻璃纤维10～100质量份，碳纳米管与玻璃纤维的质量比例(碳纳米管/玻璃纤维)为0.01～0.30。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjTELwjAQRrs4iPofzr0ORSp1lKI4OYh7uSbX9iDJhSRWBH-8BZ2cnL7Hx4M3z15XiuxAifUSObG4HKwYTRowJFaGciBDKgWx2DuaLnjgSIBtlNBSyAGdBktpEA2dhAkx3gO7_qP4xCOnJ0gH4Te1zGYdmkir7y6y9el4q88b8tJQ9KhoKjb1pSjK3b4qqvKw_cd5A1RHSKY</recordid><startdate>20230203</startdate><enddate>20230203</enddate><creator>SHOUJI HIDEKAZU</creator><creator>ISEKI SHUTA</creator><scope>EVB</scope></search><sort><creationdate>20230203</creationdate><title>Resin composition, molded article, electromagnetic wave absorber, and method for measuring absorptivity of resin composition</title><author>SHOUJI HIDEKAZU ; ISEKI SHUTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115698185A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SHOUJI HIDEKAZU</creatorcontrib><creatorcontrib>ISEKI SHUTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHOUJI HIDEKAZU</au><au>ISEKI SHUTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin composition, molded article, electromagnetic wave absorber, and method for measuring absorptivity of resin composition</title><date>2023-02-03</date><risdate>2023</risdate><abstract>Provided are: a resin composition which has a high electromagnetic wave absorption rate and low electromagnetic wave transmittance and reflectance, and which has a small difference in reflectance due to a difference in frequency of electromagnetic waves; also provided are a molded body and an electromagnetic wave absorber. The resin composition contains 0.1-10.0 parts by mass of carbon nanotubes and 10-100 parts by mass of glass fibers per 100 parts by mass of a thermoplastic resin, and the mass ratio of the carbon nanotubes to the glass fibers (carbon nanotubes/glass fibers) is 0.01-0.30.
提供一种树脂组合物，其是电磁波的吸收率高且电磁波的透射率和反射率低的树脂组合物，其中，电磁波的频率差异导致的反射率之差小；并且提供成型体和电磁波吸收体。一种树脂组合物，相对于热塑性树脂100质量份，包含碳纳米管0.1～10.0质量份和玻璃纤维10～100质量份，碳纳米管与玻璃纤维的质量比例(碳纳米管/玻璃纤维)为0.01～0.30。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Resin composition, molded article, electromagnetic wave absorber, and method for measuring absorptivity of resin composition |
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