Manufacturing method of structure and structure

A method of fabricating a structure presented includes obtaining or producing a functional electronic assembly including at least a first substrate, at least one electronic component on the first substrate, and at least one connection portion; disposing the functional electronic assembly on a first substrate film, wherein the functional electronic assembly is connected to the first substrate film via the at least one connection portion; and disposing a first material to at least partially embed the at least one electronic component into the first material. The first base film is adapted to include a recess defining a volume, and the at least one electronic component is at least partially disposed in the volume. 所呈现之制造结构之方法包含：获得或生产功能性电子总成，该功能性电子总成包含至少第一基底、在该第一基底上之至少一个电子组件、及至少一个连接部分；将该功能性电子总成设置于第一基底薄膜上，其中该功能性电子总成经由该至少一个连接部分连接至该第一基底薄膜；及设置第一材料以将该至少一个电子组件至少部分地嵌入至该第一材料中。该第一基底薄膜经调适以包含限定体积之凹部，且该至少一个电子组件至少部分配置于该体积中。