Packaging structure for improving thermal conductivity of photovoltaic module

The invention relates to the technical field of photovoltaic modules, and discloses a packaging structure for improving the heat conduction performance of a photovoltaic module, and the packaging structure comprises a silicon cell, and is characterized in that a right conductive electrode is set to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DING ZHONGJUN, LIN JUN, CHO SUN-KEUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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