Packaging structure for improving thermal conductivity of photovoltaic module
The invention relates to the technical field of photovoltaic modules, and discloses a packaging structure for improving the heat conduction performance of a photovoltaic module, and the packaging structure comprises a silicon cell, and is characterized in that a right conductive electrode is set to...
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| creator | DING ZHONGJUN LIN JUN CHO SUN-KEUN |
| description | The invention relates to the technical field of photovoltaic modules, and discloses a packaging structure for improving the heat conduction performance of a photovoltaic module, and the packaging structure comprises a silicon cell, and is characterized in that a right conductive electrode is set to be in a half-exposed or full-exposed state after plastic packaging of an epoxy molding compound is completed, so that the heat conduction performance of the photovoltaic module is improved; the left conductive electrode and the right conductive electrode can be arranged to be of a flattened and bent structure, so that high heat generated by the chip under the condition of large current can be dissipated from the exposed electrode in an accelerated manner, and meanwhile, the left conductive electrode can be arranged to be of a flattened and bent structure, so that the heat dissipation area of the end part can be increased by the flattened and bent left conductive electrode end; meanwhile, high heat generated by larg |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES SEMICONDUCTOR DEVICES |
| title | Packaging structure for improving thermal conductivity of photovoltaic module |
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