Temperature equalizing plate with built-in water cooling plate for heat dissipation
The invention relates to electronic equipment, in particular to dissipation of heat generated by high-power electronic equipment such as a server, network equipment, an LED lamp and a new energy automobile. A vapor chamber with a built-in water cooling plate for heat dissipation is composed of the b...
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| creator | ZHOU ZHEMING |
| description | The invention relates to electronic equipment, in particular to dissipation of heat generated by high-power electronic equipment such as a server, network equipment, an LED lamp and a new energy automobile. A vapor chamber with a built-in water cooling plate for heat dissipation is composed of the built-in water cooling plate and a phase change cavity, and the water cooling plate is installed in the phase change cavity. The phase change cavity is a sealed cavity manufactured according to the heat pipe principle, the surface wall of the phase change cavity is an evaporation end, and the surface wall of the water cooling plate is a condensation end. Fine heat dissipation teeth are machined in the water cooling plate, so that the internal water cooling heat exchange area is enlarged as much as possible, and the heat dissipation efficiency is improved. A connector of the water cooling plate is integrally machined and formed by metal materials and penetrates through the phase change cavity to be installed, so that |
| format | Patent |
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A vapor chamber with a built-in water cooling plate for heat dissipation is composed of the built-in water cooling plate and a phase change cavity, and the water cooling plate is installed in the phase change cavity. The phase change cavity is a sealed cavity manufactured according to the heat pipe principle, the surface wall of the phase change cavity is an evaporation end, and the surface wall of the water cooling plate is a condensation end. Fine heat dissipation teeth are machined in the water cooling plate, so that the internal water cooling heat exchange area is enlarged as much as possible, and the heat dissipation efficiency is improved. 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| language | chi ; eng |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | Temperature equalizing plate with built-in water cooling plate for heat dissipation |
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