Lead scandium tantalate surface copper plating process for electrocaloric refrigeration system

The invention discloses a lead scandium tantalate surface copper plating process for an electrocaloric refrigeration system. The lead scandium tantalate surface copper plating process comprises the following steps: step 1, chemical degreasing; step 2, ultrasonic cleaning; step 3, surface roughening;...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	QIAN JIANMIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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