Resin composition and electronic component

A molded body of the resin composition is an electromagnetic wave absorber, the imaginary part [epsilon] ''of the complex permittivity at 25 DEG C and 10 GHz and the volume resistivity [rho] v at 25 DEG C satisfy the following formula (1): 20 < (log[ rho] v) * [epsilon]'' <...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIDA TAKESHI, TSURUMI KOICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A molded body of the resin composition is an electromagnetic wave absorber, the imaginary part [epsilon] ''of the complex permittivity at 25 DEG C and 10 GHz and the volume resistivity [rho] v at 25 DEG C satisfy the following formula (1): 20 < (log[ rho] v) * [epsilon]'' < 600 (1), and the imaginary part [epsilon] ''of the complex permittivity at 25 DEG C and 10 GHz is greater than 1.25. 一种树脂组合物，该树脂组合物的成型体是电磁波吸收体，所述成型体在25℃、10GHz条件下的复介电常数的虚部ε"和25℃条件下的体积电阻率ρv满足下述式(1)，所述虚部ε"大于1.25，20＜(logρv)×ε"＜600(1)。